This popular series of business sessions provides access to leaders in the design process who offer their strategies for thriving in this fast-paced electronics industry.

Executives and senior managers will conduct panel discussions that complement technical paper sessions and add insights on current issues. Presented over two days, the Business Forum is open to all Chipheads who purchase a conference package.

8:30 am – 10:00 am	Design This! New Strategies for New Devices
	Chairperson: Jason Isberg Director, Public Relations Loomis Group
10:15 am – 11:45 am	Embracing a New Paradigm: EDA Tools and IP as Solutions Enablers
	Chairperson: Bill Martin IP Interest Group Chair, Global Semiconductor Alliance (GSA) General Manager, Verification IP Mentor Graphics
2:00 pm – 3:30 pm	Collaboration across the Changing Design Chain
	Chairperson: Dian Yang Senior Vice President, Product Management Apache Design Solutions
3:45 pm – 5:00 pm	New Media/New Marketing: Using On-Line Media to Gain a Competitive Edge
	Chairperson: Rhonda McGee Director of Research, Boston Reed Business Information
Wednesday, February 4
2:00 pm – 3:30 pm	Do It Right or Do It Over? Signal Integrity Engineer in the Era of Highly Compressed Project Schedules
	Chairperson: Paul Rako Technical Editor, EDN Magazine Reed Business Information
3:45 pm – 5:00 pm	Globalization of Product Engineering