DesignCon 2009
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Event Overview
What Kind of Chiphead Are You?

DesignCon offers a rich program of educational sessions coupled with the technology exhibition covering the broad spectrum of IC, verification, IP, PCB, PDN, and signal integrity.

Chipheads who need to stay abreast of current developments regarding design-engineering theories, techniques, and applications strategies will benefit from attending both the conference and exhibition.

Conference Tracks Span the Conference and Exhibit Floor

  • Chip-Level System Design
  • Functional Verification
  • IP Reuse and Integration
  • System Co-Design: Chip/Package/Board
  • PCB and Passive Component Technology
  • High-Speed Parallel Interface Design
  • Multi-Gigabit Serial Interconnects
  • High-Speed Timing, Jitter, and Noise
  • High-Speed Signal Processing, Equalization, and Coding
  • Power Integrity and Power-Aware Design
  • Electromagnetic Compatibility and Interference
  • Test and Measurement Methodology
  • RF and Signal Integrity
  • Business and Engineering Impacts

DesignCon Attracts a Broad Spectrum of Electronic Design Chipheads
Attendees range from all levels and disciplines of engineering professionals, including the following:

  • Applications engineering
  • Architecture and systems design
  • ASIC design
  • Circuit-board design
  • Embedded-systems design
  • Hardware/software integration
  • High-performance systems
  • IC design
  • Packaging
  • Semiconductor product management
  • Service and support
  • SoC design
  • Software development
  • Testing and debugging
  • And more!
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Sponsors


Presented by
IEC

Official Sponsor

IP Summit Sponsor

Corporate Partner

Diamond Sponsors

Le CroyTektronix

Platinum Sponsors

Gold Sponsor

IP Ecosystem Sponsor

Corporate Registration Sponsors

Bayside DesignCisco
National SemiConductorRedback
Sun MicrosystemsXilinx


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