DesignCon 2009
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DesignCon 2009

Conference: February 1-4, 2010
Exhibition: February 2-3, 2010

Santa Clara Convention Center,
Santa Clara, CA

Mark GogolewskiConference Chair

Misha Burich
Senior Vice President, Research and Development
Altera

IP Summit Chair

Yervant Zorian
Vice President
and Chief Scientist
Virage Logic

PCB Summit Chair

George Dudnikov
Senior Vice President
and Chief Technology Officer
Sanmina-SCI

View 2009 GalleryDesign Vision Award WinnersDesign Vision Award WinnersDesign Vision Award Winners
Keynote Addresses

IP Summit Chairperson

Mark Gogolewski

Mark Gogolewski
Chief Technology Officer
Denali Software

View Keynote Video

Walden Rhines

Walden Rhines
Chairman and Chief Executive Officer
Mentor Graphics

View Keynote Video

Paolo Gargini

Paolo Gargini
Director, Technology Strategy
Intel

View Keynote Video

Multimedia Hub

PodcastCatch the latest audio and video footage from our 2009 speakers and exhibitors.

PCB Design007 Interviews

Realtime Watch interviews >>

News Coverage

DFM moves from hype to reality
System-Level Design Community, February 5, 2009

Globalization 101: Learning how to communicate
System-Level Design Community, February 5, 2009

Video: USB 3.0 and power tool at DesignCon
EE Times, February 4, 2009

Moore's Law: Alive but more expensive
System-Level Design Community, February 4, 2009

EDA common wisdom...or common myths?
System-Level Design Community, February 4, 2009

'Promising' memory interface gears for mobiles
EE Times Asia, February 4, 2009

The Economics of IP
System-Level Design Community, February 3, 2009

Rhines challenges pessimistic prognosis for EDA
EE Times, February 3, 2009

Cadence, Mentor snag DesignVision Awards
EE Times, February 3, 2009

Ixia Ships 100GE Tester
Light Reading, February 3, 2009

New Momentum Represents GSA at the DesignCon Conference
Los Angeles Business, February 3, 2009

CAST Improves SDIO Host and NAND Flash Memory Controller Cores
EDN, February 3, 2009

Agilent Technologies Introduces Million-Bit-Per-Minute Channel Simulator for Signal Integrity
The Mercury News, February 3, 2009

IEC Honors Winners of 2009 DesignVision Awards Today at DesignCon in Santa Clara
Centre Daily, February 03, 2009

Signal integrity issues dog high-speed design
Lack of models a top challenge at 5 Gbits/s and beyond
EE Times, February 03, 2009

Rambus demos mobile memory interface at DesignCon
EE Times, February 02, 2009

Agilent Technologies to Demonstrate Industry-First PCI Express® Jammer, Jitter Tolerance Test for Clock Devices, Million-Bit-Per-Minute Channel Simulator at DesignCon 2009
EDA Café, February 02, 2009

Pericom Intros Oscillator
Light Reading, February 02, 2009

DesignCon 2009 Technical Paper Proceedings
DesignCon 2009

DesignCon 2009 Technical Paper Proceedings

This CD-ROM allows you access to all of the design techniques and case studies presented at DesignCon 2009 and features all of the papers presented at the event.

Winner DesignCon 2009 Video Contest
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Rambus

Sponsors


Presented by
IEC

Official Sponsor

IP Summit Sponsor

Corporate Partner

Diamond Sponsors

Le CroyTektronix

Platinum Sponsors

Gold Sponsor

IP Ecosystem Sponsor

Corporate Registration Sponsors

Bayside DesignCisco
National SemiConductorRedback
Sun MicrosystemsXilinx


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