Technology Pavilions
Featured Exhibition Floor Technology Pavilions
The DesignCon 2008 exhibition will feature leading organizations presenting EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies, and more.
 The IP Technology Pavilion showcases companies specializing in IP technology, including the following:
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 The PCB Technology Pavilion will provide a showcase for companies demonstrating products that meet the sophisticated needs of printed circuit board designers, including the following:
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 The Semiconductor Technology Pavilion will feature companies demonstrating integrated-circuit products and related technologies, including the following:
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 The Design Verification Pavilion adds a showcase area for companies specializing in functional and physical verification, including the following:
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 The University Pavilion showcases universities specializing in electronic and design engineering education. |
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RF and Signal Integrity Conference Track
New to this year's conference tracks, the RF and Signal Integrity Conference Track will highlight the hot topics in this key technology area. Exhibitors are encouraged to showcase their related products and technologies. Topics to be covered include the following:
- RF chip/package/board design and simulation
- Nonlinear RF circuit simulation with coupled chip/package/board parasitics
- RF module EMI/EMC
- Portable wireless device system signal integrity
- Portable wireless device receiver de-sense
- Portable wireless device power distribution
- RF system noise
- Digital-analog system integration
- Common mode radiation
- Intermodulation distortion, RF and LO leakage, noise figure, DC offset in radio circuits caused by chip/package/board parasitics
- RF and EMI system susceptibility
- RF and system EMC radiation
- Minimizing crosstalk in high-speed channels
- And much more!
For additional information, contact:
