Event Profile
Technology Exhibition
DesignCon attracts qualified decision makers searching for the latest products and technologies that can assist them in taking their company to the next level. Designers and professionals know that if you can exhibit at one annual electronic design event, DesignCon is the one! DesignCon provides a network with more than 130 exhibiting companies and more than 5,000 attendees!
Expo floor features include the following:
- TecPreview Theater
- New Product Showcase
- Featured Technology Pavilions
- Dedicated Expo Hours
The Technical Program
The combination of executive keynote addresses, plenary panels, and conference tracks that make up the DesignCon technical program creates a unique setting for engineers to talk to other engineers about their most challenging design problems. Assembled by leaders in the electronic-design community, the case studies, practical design techniques, technical innovations, and application tutorials draw designers working at the cutting edge of their fields.
DesignCon 2008 topics include the following:
- Chip-Level Architectural and Functional Design
- Functional and Performance Verification
- Chip-Level Physical Design and DFM
- Chip-Level Electrical and Package Design
- PCB Process Technology and Passive Component Characterization
- High-Speed Parallel Interface Design
- Multi-Gigabit Serial Interconnects
- High-Speed Timing, Jitter, and Noise
- High-Speed Signal Processing, Equalization, and Coding
- Power Integrity and Power-Aware Design
- Electromagnetic Compatibility and Interference
- Text Fixturing and Measurement Methodology
- RF and Signal Integrity
- Chip/Package/Board/System Co-Design
- Business and Engineering Impacts
Speaking Opportunities
To further position your company as an industry leader, consider taking advantage of the chairperson and speaker opportunities in the educational program. To inquire about speaker roles, please contact Barry Sullivan, program director, at bsullivan@iec.org
Proposals may also be submitted on-line at www.designcon.com/2008/conference/call_for_papers.html.
For more information on the opportunities available, please contact Christine Paplaczyk at +1-312-559-4616 or cpaplaczyk@iec.org
