Phone: +1-312-559-3325
E-mail: lreyes@iec.org
IEC Announces 2008 DesignCon Paper Award Winners
The International Engineering Consortium recognized some of the year's best papers in electronic designCHICAGO - March 11, 2008 – The International Engineering Consortium honored the best authors in the electronic design community with the prestigious 2008 DesignCon Paper Award.
The DesignCon Paper Awards serve to acknowledge the winning authors as leading practitioners in semiconductor and electronic design. The Awards also provide incentive to authors to produce high-quality DesignCon papers and present them in a lucid and compelling manner at the event.
Judges were selected from the DesignCon 2008 Technical Program Committee, which was comprised of 115 of the industry's top thought leaders.
This year's winning papers were presented as part of the 2008 DesignCon educational program, which consisted of more than 120 sessions taking place over four days at the Santa Clara Convention Center last month.
2008 Paper Award Winners include the following authors and papers in their respective categories:
Chip-Level Design Category
- Gary McCormack, Eric Sweetman and Ian Kyles, "Design and Application of Embedded Waveform Viewing Technology for Integrated Circuits"
- Vishram S. Pandit, Woong Hwan Ryu, Kirupa Pushparaj, Sankalp Ramanujam and Farag Fattouh, "Simulation and Characterization of GHz On-Chip Power Delivery Network (PDN)"
Functional and Performance Verification Category
- Adnan Hamid, "Hope Is Not a (Verification) Strategy - Coverage Model Driven Functional Scenario Generation"
Board and System Design Category
- Chad Morgan, "Solutions for Causal Modeling and A Technique for Measuring Causal, Broadband Dielectric Properties"
- Ralf Schmitt, Joong-Ho Kim, Woopoung Kim, Dan Oh, June Feng, Chuck Yuan, Lei Luo and John Wilson, "Analyzing the Impact of Simultaneous Switching Noise on System Margin in Gigabit Single-Ended Memory Systems"
Interconnect Design Category
- Dan Oh, Woopoung Kim, Joong-Ho Kim, John Wilson, Ralf Schmitt, Chuck Yuan, Lei Luo, Jade Kizer, John Eble and Fred Ware, "Study of Signal and Power Integrity Challenges in High-Speed Memory I/O Designs Using Single-Ended Signaling Schemes"
- Fangyi Rao, Chad Morgan, Sanjeev Gupta and Vuk Borich, "The Need for Impulse Response Models and an Accurate Method for Impulse Generation from Band-Limited S-Parameters"
High-Speed and RF Design Category
- Dong G. Kam, Troy J. Beukema, Young H. Kwark, Lei Shan, Xiaoxiong Gu, Petar K. Pepeljugoski and Mark B. Ritter, "Multi-Level Signaling in High-Density, High-Speed Electrical Links"
- Jim Nadolny, Julian Ferry and Cesar Arroyo, "Mode Conversion and EMI Performance of Shielded Cable Assemblies for 10 Gbps Data Transmission"
Test and Measurement Category
- Heidi Barnes, Jose Moreira, Michael Comai, Abraham Islas, Francisco Tamayo-Broes, Mike Resso, Antonio Ciccomancini, Orlando Bell and Ming Tsai, "Performance at the DUT: Techniques for Evaluating the Performance of an ATE System at the Device Under Test Socket"
Next year's DesignCon takes place at the same venue, the Santa Clara Convention Center in Santa Clara, CA, from February 2-5 with Mr. James Lin, vice president of the technology infrastructure group at National Semiconductor Corporation as the 2009 conference chair.
For photos and complete 2008 wrap-up information, visit www.designcon.com/2008/ or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.
About DesignCon 2008
Now in its twelfth year, the International Engineering Consortium's DesignCon 2008 conference and exhibition presented more than 300 experts in its world-class educational program and more than 130 exhibitors on its cutting-edge exhibition floor last week at the Santa Clara Convention Center in Santa Clara, CA. Agilent Technologies served as the official sponsor and Mr. Terry Morris, a fellow of the high performance systems division at Hewlett-Packard, served as the conference chair.
More than 120 premier educational sessions complemented four pavilions including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, and the Verification Technology Pavilion. The DesignVision Awards took place at the event giving tribute to outstanding contributions to the industry.
Co-located events included meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum also featured panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference. For photos and complete wrap-up information, visit www.designcon.com/2008/.
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.