Phone: +1-312-559-3325
E-mail: lreyes@iec.org
Ethernet Alliance and other Professional Societies Partner with IEC at DesignCon 2008 Next Week in Santa Clara
The Ethernet Alliance will demonstrate Backplane Ethernet with its member companies next week at the DesignCon 2008 exhibition in the Santa Clara Convention Center in Santa Clara, CAChicago – January 31, 2008 – The International Engineering Consortium (IEC) prepares for DesignCon 2008 next week at the Santa Clara Convention Center with key industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance (GSA), the IBIS Open Forum, the International Disk Drive Equipment and Materials Association (IDEMA), Microelectronics Packaging and Test Engineering Council (MEPTEC), SEMI and the Silicon Integration Initiative, Inc. (Si2).
"It will be an exciting time at DesignCon as these respectable organizations gather their members at DesignCon and share cutting-edge demonstrations with attendees on the exhibition floor," commented IEC President John Janowiak. "For example, we're pleased that the Ethernet Alliance and its member companies will demonstrate 10GbE Backplane Ethernet, which will showcase live traffic using streaming video and signal quality shown through a bit error rate."
Ethernet Alliance member companies participating in the demonstration include AMCC, Molex, Tyco Electronics and Vitesse. Ethernet Alliance members and executives will also participate in the DesignCon 2008 educational program in panel sessions discussing 100GbE, 10+Gb signaling and next-generation electrical signaling.
Mr. Brad Booth, president of the Ethernet Alliance further commented, "We look forward to continuing to promote Ethernet education at DesignCon 2008 and informing potential new members of the benefits and opportunities available to them as Ethernet Alliance members."
The Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum will each hold co-located events at DesignCon 2008 next week.
The DesignCon 2008 exhibition will host more than 135 exhibitors and sponsors such as Official Host Sponsor Agilent Technologies, Rambus, LeCroy, Tektronix, BERTScope, WIPRO, Amphenol, Cisco, Hewlett-Packard, IBM, Intel, Redback Networks, Sun Microsystems, Xilinx and more.
Exhibiting companies will present EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies and more.
More than 300 experts, 120 premier educational sessions and the Business Forum make up the educational conference, which will complement the exciting exhibition next week. In addition, the DesignVision Awards and the DesignCon Paper Awards will also take place recognizing outstanding contributions to the industry.
For a full exhibitor listing, visit www.designcon.com/2008/exhibition/exhibitor_list.html.
To view the entire conference schedule, visit www.designcon.com/2008/conference/schedule.html.
Visit www.designcon.com/2008/ for full information or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.
About DesignCon 2008
Now in its twelfth year, the International Engineering Consortium's DesignCon 2008 conference and exhibition will present more than 300 experts in its world-class educational program and 135 exhibitors on its cutting-edge exhibition floor this February 4-7, 2008 at the Santa Clara Convention Center in Santa Clara, CA. Agilent Technologies serves as the official sponsor and Mr. Terry Morris, a fellow of the high performance systems division at Hewlett-Packard, serves as the conference chair.
More than 120 premier educational sessions will complement five pavilions including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, the Verification Technology Pavilion and the University Pavilion. The DesignVision Awards and DesignCon Paper Awards also take place at the event giving tribute to outstanding contributions to the industry.
Co-located events include meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum will also feature panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference. For complete information, visit www.designcon.com/2008/
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.