Phone: +1-312-559-3325
E-mail: lreyes@iec.org
IEC Wraps Up DesignCon 2008 with Record-Breaking Attendance from Design Engineers, Exhibitors and Media
For two years in a row, the International Engineering Consortium (IEC) has exceeded 5,000 registrants at DesignCon 2008, its annual semiconductor engineering event in Silicon ValleyCHICAGO - February 15, 2008 – The International Engineering Consortium (IEC) wrapped up DesignCon 2008 last week with more than 5,000 registrants, 130 exhibitors and 80 media last week at the Santa Clara Convention Center in Santa Clara, CA with Agilent Technologies as the official host sponsor.
"The response we received to DesignCon 2008 last week from attendees, exhibitors and media is illustrative of quality of education our sessions and exhibition floor provide to design engineers," commented IEC President John Janowiak. "We are extremely grateful to all our exhibitors, major sponsors, speakers, Technical Program Committee members, media partners, associate partners, DesignVision judges and everyone involved in producing such a successful conference and exhibition."
Major sponsors of the event included Official Host Sponsor Agilent Technologies; Rambus; LeCroy; Tektronix; BERTScope; Amphenol; Cisco; Hewlett Packard; IBM; Intel; Redback Networks; Sun Microsystems; Xilinx; and Wipro.
Hundreds of design tools were showcased on the DesignCon 2008 exhibition floor, which included EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, RF and signal integrity technologies and more. DesignCon 2008 brought box and board designers together with chip designers and everyone involved in system-level design.
The DesignVision Awards and DesignCon Paper Awards also took place at the event honoring outstanding contributions to the industry.
Co-located events included meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum also featured panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference.
For photos and complete wrap-up information, visit www.designcon.com/2008/ or contact Lisa Ann Reyes at lreyes@iec.org or +1-312-559-3325.
About DesignCon 2008
Now in its twelfth year, the International Engineering Consortium's DesignCon 2008 conference and exhibition presented more than 300 experts in its world-class educational program and more than 130 exhibitors on its cutting-edge exhibition floor last week at the Santa Clara Convention Center in Santa Clara, CA. Agilent Technologies served as the official sponsor and Mr. Terry Morris, a fellow of the high performance systems division at Hewlett-Packard, served as the conference chair.
More than 120 premier educational sessions complemented four pavilions including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, and the Verification Technology Pavilion. The DesignVision Awards and DesignCon Paper Awards also took place at the event giving tribute to outstanding contributions to the industry.
Co-located events included meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum also featured panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference. For photos and complete wrap-up information, visit www.designcon.com/2008/.
About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.