International Engineering Consortium
300 West Adams Street, Suite 1210
Chicago, Illinois 60606-5114, USA
Phone: +1-312-559-3325
Fax: 1-312-559-4111
E-mail: lreyes@iec.org
| Official PR Sponsor | |
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To participate in this paid opportunity, fill out an order form at: http://virtualpressoffice.com/media/order/
To view the Exhibitor News Page, visit: http://virtualpressoffice.com/media/show/
Only PR professionals representing exhibitors at DesignCon 2008 will receive access to this list.
Press Credentials may be picked up at the Press Registration Counter on-site. Press and analysts must present a business card to pick up their Press Badge.
- Create a pre-show press release announcing your booth and specifics of your product launch or exhibit at the show.
- Send invitations and a DesignCon 2008 VIP pass to your customers.
- Do a pre-show direct mailing or send a postcard to potential customers.
- Add the DesignCon logo to your own Web site announcing your booth and highlighting activities at the show. Visit the logo library here: www.designcon.com/2008/exhibitor_info/logo_library.html.
- Develop a booth traffic builder - explain why people should visit your booth.
- Include DesignCon name and your booth number in all pre-show advertising.
- Include DesignCon name and your booth number in a snipe on all regular product and brand advertising placed prior to the show.
For complete information on PR opportunities available to you as an exhibitor, please contact lreyes@iec.org.
More than 120 premier educational sessions will complement five pavilions, including the IP Technology Pavilion, the PCB Technology Pavilion, the Semiconductor Technology Pavilion, the Verification Technology Pavilion and the University Pavilion. The DesignVision Awards and DesignCon Paper Awards also take place at the event, giving tribute to outstanding contributions to the industry.
Co-located events include meetings held by industry associations such as the Ethernet Alliance, the Global Semiconductor Alliance and the IBIS Open Forum. The Business Forum will also feature panel sessions led by senior managers and executives addressing critical business and strategy issues of concern to those responsible for directing the design process. One hundred and fifteen top thought leaders served as part of the Technical Program Committee, which helped develop this year's educational conference. For complete information, visit www.designcon.com/2008.
In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have a substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.
More than 70 leading universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.








