CMP offers the fabrication of integrated circuits for prototyping and low volume production, for Universities and industry. Technologies offered are CMOS down to 65nm 7LM, SiGe BiCMOS down to 0.25µ 5LM, BCD SOI 0.8µ 80V, GaAs HEMT 0.2µ, SOI/SOS 0.5µ CMOS, InP HBT... About 50 multi-project runs are scheduled per year. Micro Electro Mechanical Systems (MEMS) are also provided. More than 1000 Universities, Research Laboratories and Industrial Companies from 66 countries have been served already. The portfolio of CMP is much diversified.

It covers a wide range of circuit specifications: digital circuits, analog, mixed signal, RF, microwave, low power, high voltage, radiation tolerance, etc. Design of Systems including IPs is available with the libraries, design-kit, compiled memories, ARM IP,…. CMP has low costs due to the sharing of silicon wafers among several users. Complete services form the supply of design tools until the packaged circuits ready for testing is offered. Customized support all along the steps of submission for fabrication is ensured.

A more general benefit for the customer is the access to the most advanced technologies, else not accessible for such cost and volume. In 2007, CMP offered the access to the 65nm. Up to now, 73 Universities worldwide have received the design rules and design kits fo the ST CMOS 65nm. Every year about 300 tapeouts coming from about 150 customers are fabricated and delivered in prototypes or low volume productions. For more information on CMP, please visit: http://cmp.imag.fr