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Austin, Texas USA Phone: 512-984-1800 Fax: 512-984-3827 www.3m.com/interconnect |
Booth # 428 |
System design engineers working with VME and CompactPCI backplane systems now have a cost-effective
path to higher speed serial I/O protocols such as PCI Express and RapidIO without disruptive backplane
redesign or a forklift upgrade using the new 3M brand MetPak brand HSHM Press-Fit B19 Connector. The
3M Electronic Solutions Division provides a wide range of products for the electronics market. It provides
products and solutions to meet the electronic industry's challenges of protecting sensitive components
and precisely delivering them to the assembly point, as well as flexible circuits, embedded capacitance
laminate materials, copper interconnect systems; cables and cable assemblies; static control products,
and Textool brand test and burn-in sockets.
Technologies on Display
- HSHM B19Legacy VERSAmodule Eurocard(VME)and Compact PCI (cPCI) systems cannot support newer high speed serial I/O protocols such as PCI Express or Rapid IO without a forklift to the backplane. Standards allow faster speeds, but current high speed connectors are not backward compatible with 5 row 2mm hard metric connectors on legacy VME64x with VITA31 and PICMG 2.16 backplane. What if you could supercharge legacy VME and cPCI backplanes to 5 Gbps without disruptive and expensive backplane redesign and a forklift chassis upgrade? 3M(TM) MetPak High Speed Hard Metric (HSHM) Press-Fit B19 Connectors are designed to resolve this problem and provide a cost-effective upgrade to higher speed. With speeds up to 5 Gbps, 3M MetPak HSHM B19 fully shielded connector mates with 2 mm 5 row cPCI/hard metric headers; connectors PO on VME64x with VITA31 and P3 on cPCI with PICMG2.16. Full pin-to-pin compatibility can be maintained with existing VME and cPCI backplanes. A performance improvement up to 3X can be obtained by using daughter cards with MetPak HSHM B19 sockets mated to standard 5 row 2 mm hard metric headers.