For the past 10 years research on electrical signaling for chip-to-chip and board-to-board applications has been focusing on 10 Gbps. The research and completion of the OIF CEI-11G and the IEEE 802.3ap Backplane Ethernet specifications is being leveraged by other groups to aid in rapid deployment of 10 Gbps electrical signaling.

The IEEE 802.3 Higher Speed Study Group recently adopted a rate of 100 Gbps to deal with the exponential growth of data in core networking and aggregation applications. For systems supporting these applications, 10 Gbps signaling will be insufficient. Research into higher electrical signaling rates must begin.

This panel will bring together experts from various disciplines within the industry-backplane and cabling interconnect, board materials, test experts, system architects, and chairs of the organizations that define electrical signaling. The panel will provide their viewpoints based on their disciplines of what the state of the art is and what is needed to make 20 to 25 Gbps electrical signaling reality.

Lee H. Goldberg Senior Technology Editor EN-Genius.com

At EN-Genius, an on-line magazine that provides information on technologies, design practices, and products for electronics engineers, Mr. Goldberg covers networking, connectivity, DSP, and FPGA technologies. He also edits the green-tech ZONE and green-power ZONE, sections that cover issues related to technology and the environment. In 1994, He joined Electronic Design magazine and spent five years there as the communication technology editor before joining ChipCenter, an on-line engineering magazine. Lee holds a B.S.E.E. from Thomas Edison College.

Brad Booth Senior Principal Engineer AMCC

Mr. Booth drives alignment of AMCC's strategic planning to industry initiatives and standards and serves as the president for the Ethernet Alliance. Previously, he was the manager of Intel's Enterprise Interconnect Standards Team and held positions as director and vice president of technology for the 10 Gigabit Ethernet Alliance. He was the treasurer of IEEE 802.3, chaired the IEEE Std. 802.3anTM (10GBASE-T) — 10 gigabit Ethernet over twisted-pair copper cabling — and was the editor-in-chief for IEEE Std. 802.3aeTM for 10 gigabit Ethernet on fiber-optic cabling. Mr. Booth has received recognition as a senior member of the IEEE (2003) and was recently recognized (December 2006) as one of the 50 most powerful people in networking by NetworkWorld.

David Brunker Technical Fellow Molex Inc.

Mr. Brunker is involved in defining high-speed product direction and maintaining internal communications of associated technologies. He has developed products in the areas of shielded and high-speed connectors, high-speed cable and backplane transmission links, and fiber optics. Mr. Brunker has contributed to various standards organizations and MSAs, including IEEE 1394a and 1394b, DVI, VESA, EVC, SSA, and OIF. He holds more than 50 U.S. patents and received his B.S. in psychology with emphasis in psychoacoustics from the University of Illinois at Urbana-Champaign.

Michael Fogg Senior Member of Technical Staff Tyco Electronics

Mr. Fogg has been active in connector and cable design, modeling, and test since 1984. He has worked on a variety of interconnect products, most recently on the SFP+ pluggable transceivers, proposals for 100GbE module systems, Mini RJ-21 (25 pair Cat-5E), Category 6A interconnects, and 25 Gbps cable connectors. Mr. Fogg has also received 26 patents for a variety of types of high-performance connectors. He has an M.S. in engineering and a B.S. in electrical engineering from the Pennsylvania State University.

Joel Goergen Vice President of Technology and Chief Scientist Force10 Networks

In addition to Force10 Networks, Mr. Goergen actively participates in various standards bodies such as IEEE802, OIF, and ITU. Prior to joining Force10, he headed research projects focused on high-speed copper signaling at Bell Labs, Ascend Communications, Transition Networks, and MTS Systems. Mr. Goergen holds 12 patents related to his work developing the Force10 E-Series backplane. He sits on the technical advisory board for Quellen and contributes to various curriculum advisory groups at St. Cloud State University. He received a B.S. in electrical engineering and a B.A. in mathematics from St. Cloud State University.

Adam Healey Consulting Member of Technical Staff LSI Corporation

Mr. Healey is engaged in the development of high-speed serial interface solutions. He is a contributor to industry standards and recently served as chairman of the IEEE P802.3ap Task Force, chartered to develop the standard for Ethernet operation over electrical backplanes. Mr. Healey also served a technical committee chairman and vice president of Technology for the Ethernet Alliance.

Mike Resso Signal Integrity Measurement Specialist, Component Test Division Agilent Technologies

Mr. Resso has more than 20 years of experience in the test and measurement industry. His background includes the design and development of electro-optic test instrumentation for aerospace and commercial applications. Mr. Resso's most recent activity has focused on the complete multiport characterization of high-speed digital interconnects using time domain reflectometry and vector network analysis. He has authored more than 25 professional publications and received one U.S. patent. Mr. Resso received a Bachelor of Science degree in electrical and computer engineering from University of California.

David Stauffer Senior Technical Staff Member IBM, ASIC Design Center

Dr. Stauffer is also the chair of the OIF Physical and Link Layer Working Group. He serves as IBM's representative to OIF and to the INCITS T11.2 Fibre Channel Physical Variants Task Group and has contributed to standards development in both of these organizations. He has additionally co-authored presentations contributing to IEEE 802.3ap development.