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Monday, February 4

9:00 am – 12:00 pm	TF-MA1 | Tutorial The Great EDA Cover-Up: Coverage Metrics Explained
	TF-MA2 | Tutorial Advances in Gigabit Channel Measurement-Based Characterization and Simulation
	TF-MA3 | Tutorial Chip, PCB, and Connector Technologies for Meeting Today's and Tomorrow's 10+Gb Signaling Requirements — a Report on Current Trends and Future Road Maps
	TF-MA4 | Tutorial Computational Electromagnetics: From Maxwell's Equations to Signal Integrity and System Design
	TF-MA5 | Tutorial Tools for Reducing the Hidden Costs in the IP Supply Ecosystem

12:30 pm – 1:00 pm	Monday Keynote Address
	Speaker: Joachim Kunkel Vice President and General Manager Synopsys

1:30 pm – 4:30 pm	TF-MP1 | Tutorial Design of High-Performance Adaptive FIR Filters Using FPGA
	TF-MP2 | Tutorial Developing Interoperable Algorithmic Models Quickly — A Tutorial
	TF-MP3 | Tutorial Design and Verification for Jitter and High-Speed I/Os at Multiple Gbps
	TF-MP4 | Tutorial AdvancedTCA (ATCA) Platform Design and Applications: A New Day in Scalable Telecom System Deployment
	TF-MP5 | Tutorial The ABCs of System-Level Design

4:45 pm – 6:00 pm	Technical Panel Is Coverage the Best Metric for Verification Closure?
	Chairperson: Faisal Haque Director of Engineering QUALCOMM
	Technical Panel Challenges in Verification and Compliance of Serial Data Technologies
	Chairperson: Chris Loberg Senior Manager of Marketing Tektronix
	Technical Panel Understanding the Impact of 100G Ethernet
	Chairperson: Loring Wirbel Director and Senior Analyst, Market Intelligence Unit EE Times

Tuesday, February 5

8:30 am – 9:10 am	1-TA1 How to Quickly Create Complicated Message Sequence Charts Automatically without Spending Money on Software
	5-TA1 Utilization of Buried Capacitance(TM) — A Case Study
	7-TA1 The Impact of Common Mode Currents and Interconnect Inductance on the Signal Quality of Differential Signals in Multi-Board PCB Systems
	8-TA1 Analysis of Crosstalk Effects on Jitter in Transceivers
	10-TA1 Impact of PCB Laminate Dimensions on Suppressing Modal Resonances
	12-TA1 Challenges and Solutions for Removing Fixture Effects in Multiport Measurements
	15-TA1 Is Congress Killing Innovation?

8:30 am – 10:00 am	Business Forum Panel Managing Unit Costs: Methodologies and Processes to Lower Overall Chip Costs
	Chairperson: Adam Traidman President Chip Estimate Corporation

9:20 am – 10:00 am	1-TA2 Designing and Verifying Ratio Synchronous Clocks (RSC) for High-Performance Low-Power Processors
	5-TA2 Application of Foldy-Lax Multiple Scattering Method to Via Analysis in Multilayered Printed Circuit Board
	7-TA2 Data Mining 12-Port S-Parameters
	8-TA2 Modeling a Phase Interpolator as a Delta-Sigma A/D converter
	9-TA2 Design Considerations in High-Speed SerDes (25Gbps)
	10-TA2 High Bandwidth Modeling and Simulation of SSO Effects on Single-Ended Switching Performance of Complex FPGA System Designs
	12-TA2 Broadband Resonant-Plate Permittivity Measurement Technique for Printed Wiring Boards Aided by Electromagnetic Simulations
	15-TA2 Case Study Using the VSIA QIP to Evaluate Internally Developed Information Property

10:15 am – 10:55 am	1-TA3 ESL Driven Instrumentation Interfaces
	2-TA3 Hope Is Not a (Verification) Strategy — Coverage Model-Driven Functional Scenario Generation
	5-TA3 Modeling Issues and Possible Solutions in the Design of High Speed Systems with Signals at 20 Gbps
	7-TA3 Demonstration of SerDes Modeling Using the Algorithmic Model Interface (AMI) Standard
	8-TA3 Characterization of Gaussian Noise Sources
	10-TA3 Analyzing the Impact of Simultaneous Switching Noise on System Margin in Gigabit Single-Ended Memory Systems
	13-TA3 Study of Fundamental Limit and Packaging Technology Solutions for 40 Gbps Transceiver Package Design
	15-TA3 Lifecycle Cost Is a DIME — How to Make Build/Buy Decisions

10:15 am – 11:45 am	Business Forum Panel Executive Views on the Turbulent FPGA Landscape
	Chairperson: Kevin Morris Journal Editor FPGA

11:05 am – 11:45 am	1-TA4 A Reset Control Apparatus for PLL Power-Up Sequence and Auto-Synchronization
	2-TA4 Bridging Block-Level to Top-Level CDC Verification: Hierarchical CDC Verification
	5-TA4 Solutions for Causal Modeling and a Technique for Measuring Causal, Broadband Dielectric Properties
	7-TA4 BladeServer 10 Gbps Ethernet Backplace Design with Equalization Using Statistical Channel Analysis
	8-TA4 Crosstalk Measurement, Extraction, and Validation in 10 Gbps Serial Systems
	10-TA4 Pushing the Envelope without Tears: An Advanced Power Delivery Solution
	13-TA4 Issues of Frequency Content of S-Parameter Data for High-Speed Channel Evaluation
	15-TA4 ASIC 2-0
12:00 pm	DesignVision Awards Ceremony

12:00 pm – 12:30 pm	Tuesday Keynote Address
	Speaker: Misha Burich Senior Vice President, Research and Development Altera

12:30 pm

Ribbon Cutting Ceremony

12:30 pm – 6:30 pm

Technology Exhibition

12:30 pm – 2:00 pm

Lunch Served on Exhibition Floor

2:00 pm – 2:40 pm	1-TP1 Design and Application of Embedded Waveform Viewing Technology for Integrated Circuits
	2-TP1 A Python-Based SoC Validation and Test Environment
	5-TP1 ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials
	7-TP1 Strategies for Coping with Nonlinear and Time Variant Behavior for High-Speed Serial Buffer Modeling
	8-TP1 A Novel Approach for Characterizing Pulse Width Shrinkage in High-Speed Digital Communications Systems
	10-TP1 Using Full Wave Solvers for Practical Analysis of Capacitor Mounting Structures
	13-TP1 Validation Methods for S-Parameter Measurement-Based Models of Differential Transmission Lines
	15-TP1 BDU — A Complexity Measure for a Board Design Project

2:00 pm – 3:30 pm	Business Forum Panel Ecosystem Environment for Starting a Semiconductor Company
	Chairperson: Steve Szirom Founder InsideChips

2:50 pm – 3:30 pm	1-TP2 Methods for Configurable Hardware Design
	2-TP2 Sources of Non-Determinism in Microprocessors
	4-TP2 Simulations and Characterizations for GHz On-Chip Power Delivery Network (PDN)
	7-TP2 Multi-GB/s Serial Channel Design Using a Hybrid Measurement and Simulation Platform
	8-TP2 Exploration of Deterministic Jitter Distributions
	11-TP2 Mode Conversion and EMI Performance of Shielded Cable Assemblies for 10 Gbps Data Transmission
	13-TP2 A New Test Fixture Crosstalk De-Embedding Technique Using Time-Domain Gating
	14-TP2 Modeling FPGA Current Waveform and Spectrum and PDN Noise Estimation

3:45 pm – 5:00 pm	Technical Panel ASIC Verification
	Chairperson: Gary Smith Founder and Chief Analyst Gary Smith EDA
	Technical Panel High-Speed PCB Traces: What Is Their Real Performance?
	Chairperson: Istvan Novak Distinguished Engineer Sun Microsystems
	Technical Panel The Call for Industry Research on Next Generation Electrical Signaling
	Chairperson: Lee H. Goldberg Senior Technology Editor EN-Genius.com
	Business Forum Panel Emerging Markets — Tackling Market Opportunities in India
	Chairperson: Elizabeth Corcoran Senior Editor, Technology Coverage Forbes.com

5:00 pm – 6:30 pm

Reception on Exhibition Floor

Wednesday, February 6

8:45 am – 9:25 am	1-WA1 Multimedia Application Specific Engine Design Using High-Level Synthesis
	3-WA1 Using Programmable Logic for Receiver Offset and Yield Enhancement
	6-WA1 A Fast Algorithm to Instantly Predict FPGA SSN for Various I/O Pin Assignments
	7-WA1 The Need for Impulse Response Models and an Accurate Method for Impulse Generation from Band-Limited S-Parameters
	9-WA1 Semi-Analytic Performance of NRZ/PAM4/PR2 Modulation across 8.5-25 Gbps Backplanes with Analog Equalization
	11-WA1 Heat Sink Design Flow for EMC
	12-WA1 A Jitter Estimation Method for Cascaded, Programmable Phase-Locked Loops
	14-WA1 The Future of Multi-Clock Systems

8:45 am – 10:20 am	Business Forum Panel Refining or re-defining the Analog Design Sign-Off Flow
	Chairperson: Gary Smith Founder and Chief Analyst Gary Smith EDA

9:40 am – 10:20 am	1-WA2 Evaluating Embedded Non-Volatile Memory for 65 nm and Beyond
	3-WA2 Packaging DfM into Design Service
	6-WA2 Challenges in Implementing DDR3 Memory Interface on PCB Systems - A Methodology for Interfacing DDR3 SDRAM DIMM to an FPGA
	7-WA2 Aggregation of Crosstalk in Backplanes
	9-WA2 Pre-Cursor ISI Cancellation
	11-WA2 Loaded Parallel Stub Common Mode Filter
	12-WA2 50 GHz End Launch Connector Test Boards: the Description of the Development of Coax to Grounded Coplanar Launches and Through Lines on 30 mil Rogers 4350 Material with Comparison to Microstrip
	14-WA2 Interface Based Design Concepts for IC, PKG, PCB Co-Design

10:30 am – 11:45 am	Plenary Panel Navigating the ASIC Manufacturing Landscape
	Chairperson: Kazu Yamada Vice President and General Manager, Custom SOC Solutions Business Unit NEC Electronics America

12:00 pm – 12:30 pm	Keynote Address
	Rick Cassidy President TSMC North America

12:30 pm – 6:30 pm

Technology Exhibition

12:30 pm – 2:00 pm

Lunch Served on Exhibition Floor

2:00 pm – 2:40 pm	2-WP1 How to Find if My Checker Is Complete and Exhaustive — A Set of Guidelines Using Systemverilog and Memory Controller Example
	4-WP1 Process and Temperature Variations on Electrical Parameters of Wire-Bond BGA Packages: an Impact Analysis Using Simulation-Based DOE Methodology
	6-WP1 Counting the Picoseconds: Integrating Timing, Signal, and Power Integrity Analysis
	8-WP1 PCI Express Timing Margins
	9-WP1 Half-Rate Decision-Feedback Equalization — Di-Bit Response Analysis & Evaluation
	11-WP1 Cable EMI Characterization Using a Reverberation Chamber
	12-WP1 High-Speed Serial Interconnect Imbalance
	14-WP1 Efficient Modeling and Design Optimization Methodology for Integrated Power and Signal Distribution in Digital Systems

2:00 pm – 3:30 pm	Business Forum Panel Where Is the ROI for DFM?
	Chairperson: Mike Santarini Senior Editor EDN

2:50 pm – 3:30 pm	2-WP2 Mixed-Signal Integration: Functional Verification in the Presence of Linear Analog Components
	4-WP2 FPGA I/O Timing Variations Due to Simultaneous Switching Outputs
	6-WP2 Study of Signal and Power Integrity Challenges in High-Speed Memory I/O Designs Using Single-Ended Signaling Schemes
	8-WP2 A Systematic Approach to Solving Clock Synthesis and Clock Recovery Problems in High-Data-Rate Serial Bus Systems
	9-WP2 Multilevel Signaling in High-Density, High-Speed Electrical Links
	11-WP2 EMI Shielding of Cable Assemblies
	12-WP2 Characterization Methodology for High-Density Microwave Fixtures
	14-WP2 Techniques for Co-Design of the Power Supply Chain from IC to Printed Circuit Board

3:45 pm – 5:00 pm	Technical Panel IP Standards — Where Do We Go from Here?
	Chairperson: Jim Lipman Vice President, Client Services Cain Communications
	Technical Panel Advanced High-Speed Serial Channel Metrics
	Chairperson: Dave Brunker Technical Fellow Molex Incorporated
	Technical Panel Package Extraction, Modeling, and Simulation in IC-Packaging-Board Design
	Chairperson: Vikram Jandhyala Founder and CEO Physware, Inc.
	Business Forum Panel Designing a More Fulfilling Career
	Chairperson: John Epperheimer Partner St. Charles Consulting Group

5:00 pm – 6:30 pm

Reception on Exhibition Floor