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Call for Papers | Submit a Proposal | List of Topics | Technical Program Committee

Submission Deadline: August 17, 2007
Papers Due: November 16, 2007

The International Engineering Consortium is pleased to announce this Call for Papers for DesignCon 2008, the premier educational conference and technology exhibition for semiconductor and electronic design engineers. At DesignCon, engineers talk to engineers to find practical solutions to the challenging problems they share in design and verification. We emphasize education and peer-to-peer sharing among practicing engineers, creating a unique atmosphere for learning about state-of-the-art design methodologies and technologies. Individuals presenting papers at DesignCon will join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews.

We solicit papers for two types of sessions: technical papers and TecForum tutorials. Technical papers, which are up to 25 pages long, address design case studies and application overviews and are presented in 40-minute sessions. TecForums are half-day (three-hour) tutorial sessions with papers up to 50 pages long, allowing the speakers to cover their topics in greater depth and breadth. TecForum tutorials are scheduled for Monday, February 4; the technical sessions will be held on Tuesday–Thursday, February 5–7.

Submissions for the Business Forum and Technical Panels are listed on DesignCon Call for Proposals

A link to the list of suggested topics for DesignCon 2008 appears below. To submit a proposal, prepare a 100-word (maximum length) abstract and 500-word (minimum length) summary and complete the on-line submission form on the DesignCon Web site by August 17, 2007. The DesignCon 2008 Technical Program Committee will review all submissions based on quality, relevance, impact, and originality. Prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, as long as product references add to the educational value and are presented in an appropriately noncommercial fashion.

1. Quality – DesignCon papers should be well organized and easily understood. The abstract and summary are judged as indicators of what can be expected of the prospective authors for a full-length paper.
2. Relevance – The paper should be highly relevant to the interests of the DesignCon audience in general and the track topic in particular.
3. Impact – DesignCon papers should contribute to the educational mission of DesignCon. Submissions reporting on important results, methodologies, or case studies of special significance will be considered favorably.
4. Originality – Reports on new design methodologies, case studies for innovative designs, or other novel results contribute to the DesignCon goal of providing a high-quality educational program for practicing engineers. However, outstanding papers on "classical" topics will also be viewed favorably.
5. Commercial content – It is acceptable to use a product in a design case study or as a proof of concept for a design methodology. Product promotion is not permitted in DesignCon technical sessions. Evidence of product promotion in a paper proposal will lead to rejection of the proposal.

All relevant proposals-including topics other than those listed—will be considered. Submissions on related standards activities are welcome.

List of Topics | Submit a Proposal

Barry Sullivan
DesignCon 2008 Conference Director
+1-312-559-3302 phone
+1-312-559-4127 fax
bsullivan@iec.org