9-WP2
Multilevel Signaling in High-Density, High-Speed Electrical Links
Wednesday, February 6 | 2:50 pm – 3:30 pm
Dong Kam, Postdoctoral Researcher, IBM T. J. Watson Research Center
Troy Beukema, Research Staff Member, IBM
Young Kwark, Research Staff Member, IBM
Lei Shan, Research Staff Member, IBM
Xiaoxiong Gu, Research Staff Member, IBM
Petar Pepeljugoski, Research Staff Member, IBM T. J. Watson Research Center
Mark Ritter, Research Manager, IBM T. J. Watson Research Center
We present an analysis comparing multilevel signaling to standard NRZ signaling for module-to-module on-board electrical interconnects. To optimize on-board electrical performance, duo-binary and PAM4 I/O models were created and compared to NRZ signaling in behavioral link-level simulations. A great variety of high-density, high-speed on-board module-to-module electrical links were analyzed, and specific interconnect channels were validated experimentally with programmable equalization transceiver chips communicating through a set of fabricated test structures. Link performance was measured with on-chip eye monitoring circuits and an oscilloscope. Both simulation and measurement results show that NRZ signaling with FFE and DFE equalization offers the best electrical performance.
Troy Beukema, Research Staff Member, IBM
Young Kwark, Research Staff Member, IBM
Lei Shan, Research Staff Member, IBM
Xiaoxiong Gu, Research Staff Member, IBM
Petar Pepeljugoski, Research Staff Member, IBM T. J. Watson Research Center
Mark Ritter, Research Manager, IBM T. J. Watson Research Center
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