Implementing multi-gigabit serial designs requires accurate and efficient methodologies to meet performance and time-to-market goals. The interplay between measurement and simulation is important, and an awareness of how each can be applied in an optimized and complementary manner drastically improves the chances of achieving first-pass success. Innovative TDR-based measurement techniques are combined with 3D electromagnetic modeling and advanced circuit simulation to construct a modular design platform, which supports efficient design management without sacrificing accuracy. The effectiveness of this platform will be demonstrated on a PCB test board and an HDMI channel test case.