7-TP2
Multi-GB/s Serial Channel Design Using a Hybrid Measurement and Simulation Platform
Tuesday, February 5 | 2:50 pm – 3:30 pm
Andrew Byers, Application Engineer, Ansoft
Dima Smolyansky, Product Marketing Managers, Tektronix
Eugene Mayevskiy, Application Engineer, Tektronix
Will Miller, Vice President of Engineering, Efficere Technologies
Implementing multi-gigabit serial designs requires accurate and efficient methodologies to meet performance and time-to-market goals. The interplay between measurement and simulation is important, and an awareness of how each can be applied in an optimized and complementary manner drastically improves the chances of achieving first-pass success. Innovative TDR-based measurement techniques are combined with 3D electromagnetic modeling and advanced circuit simulation to construct a modular design platform, which supports efficient design management without sacrificing accuracy. The effectiveness of this platform will be demonstrated on a PCB test board and an HDMI channel test case.
Dima Smolyansky, Product Marketing Managers, Tektronix
Eugene Mayevskiy, Application Engineer, Tektronix
Will Miller, Vice President of Engineering, Efficere Technologies