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Conference ScheduleInfoVault
5-TP1
ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials
Tuesday, February 5 | 2:00 pm – 2:40 pm

Heidi Barnes, Senior Consultant, Verigy
Jose Moreira, Senior Application Consultant, Verigy
Tom McCarthy, Vice President, Taconic
William Burns, Senior Applications Engineer, Altanova
Crescencio Gutierrez, Engineering and R&D Manager, Harbor Electronics
Mike Resso, Signal Integrity Measurement Specialist, Agilent Technologies
PCB materials directly influence attenuation and NEXT/FEXT crosstalk signal integrity of an ATE loadboard design. Balancing performance, cost, and ease of fabrication requires a quantitative understanding of the impact that the dielectric material has on the performance of a multi-gigabit loadboard signal path. An understanding of how the material will perform when used to fabricate 20+-layer-count ATE boards with thicknesses of more than 200 mils is required. This paper provides an analysis of various loadboard PCB materials for a nominal loadboard test fixture design with 10 inches of path length and data rates up to 43 Gbps.