5-TP1
ATE Interconnect Performance to 43 Gbps Using Advanced PCB Materials
Tuesday, February 5 | 2:00 pm – 2:40 pm
Heidi Barnes, Senior Consultant, Verigy
Jose Moreira, Senior Application Consultant, Verigy
Tom McCarthy, Vice President, Taconic
William Burns, Senior Applications Engineer, Altanova
Crescencio Gutierrez, Engineering and R&D Manager, Harbor Electronics
Mike Resso, Signal Integrity Measurement Specialist, Agilent Technologies
PCB materials directly influence attenuation and NEXT/FEXT crosstalk signal integrity of an ATE loadboard design. Balancing performance, cost, and ease of fabrication requires a quantitative understanding of the impact that the dielectric material has on the performance of a multi-gigabit loadboard signal path. An understanding of how the material will perform when used to fabricate 20+-layer-count ATE boards with thicknesses of more than 200 mils is required. This paper provides an analysis of various loadboard PCB materials for a nominal loadboard test fixture design with 10 inches of path length and data rates up to 43 Gbps.
Jose Moreira, Senior Application Consultant, Verigy
Tom McCarthy, Vice President, Taconic
William Burns, Senior Applications Engineer, Altanova
Crescencio Gutierrez, Engineering and R&D Manager, Harbor Electronics
Mike Resso, Signal Integrity Measurement Specialist, Agilent Technologies






