The authors applied Foldy-Lax multiple scattering equations to analyze signal and ground vias in multilayered printed circuit boards. The Foldy-Lax method solves multiple via coupling between two power/ground planes. It also takes into account physical dimensions of via structure, including drill size, anti-pad size, and via spacing. The outputs of this method are via models of different layers in terms of S-parameters, which can be imported easily into most circuit simulators. Comparison is also shown between the Foldy-Lax method and our previous cavity via model for a high-speed electrical link study. Good model-to-hardware correlation is demonstrated up to 40 GHz.