This paper describes how a simulation based on a two-level, fractional factorial DOE methodology is used to analyze the impact of process and temperature variations on electrical parameters of a FPGA wire-bond BGA package. Nine design factors are chosen to cover material properties, package geometries, and simulation setup. Eight design responses include self-inductance, self-capacitance, mutual inductance, mutual capacitance, DC resistance, AC resistance, impedance, and propagation delay. Linear regression models are built for each DOE response for variation prediction. DOE data is generated from simulation using a 3D quasi-static electromagnetic solver.