The International Engineering Consortium is pleased to provide you with the following DesignCon logos. These logos are available to assist companies in highlighting their involvement in DesignCon and are to be used only in conjunction with marketing materials and communications promoting your involvement in the event.

All logos should always have at least 0.75" of clear space around them to separate them from surrounding elements. All logos may be reproduced only as submitted and may not be altered in any way.

	Chip Head Logo EPS (High Resolution) Format JPG Format
	DesignCon Logo EPS (High Resolution) Format JPG Format
	DesignCon 2007 Logo EPS (High Resolution) Format JPG Format
	DesignCon Logo with Chip Head EPS (High Resolution) Format JPG Format
	DesignCon Exhibitor Logo 234 x 60 GIF Format 120 x 60 GIF Format
	DesignTOUR Logo EPS (High Resolution) Format JPG Format
	IEC Logo JPEG Format GIF Format
	PCB Technology Pavilion Logo EPS (High Resolution) Format JPG Format
	Semiconductor and IP Technology Pavilion Logo EPS (High Resolution) Format JPG Format
	Verification Technology Pavilion Logo EPS (High Resolution) Format JPG Format