Technology Exhibition
The exhibition continues to grow at DesignCon and 2007 is no exception. Leading companies will be presenting the latest EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies, and will emphasize developments in ESL, verification, and nanometer design. Attendees will have the invaluable opportunity to network and view the latest tools for all of their design to implementation needs.
Conference Program
The combination of executive keynote addresses, plenary panels, and conference tracks that comprises the DesignCon technical program creates a unique setting for engineers to talk to other engineers about their most challenging design problems. Assembled by leaders in the electronic-design community, the case studies, practical design techniques, technical innovations, and application tutorials draw designers working at the cutting edge of their fields.
DesignCon 2007 topics will include the following:
- Chip-Level Functional Design
- Chip-Level Physical Design and Verification
- Power and Package Co-Design
- PCB, Package, and Passive Technologies
- Chip and Board Interconnect Design
- High-Performance Backplane Interconnect Design
- High-Speed Timing, Jitter, and Noise
- Power Integrity
- Functional Verification
- Business Issues
TecForums
TecForums provide in-depth discussions on focused topics and offer attendees even more opportunity to meet with industry leaders. These focused technical forums give attendees the opportunity to explore the answers to their most challenging design problems.
Technical Sessions
The technical sessions constitute the core of the technical program at DesignCon. Authors selected from respondents to an open Call for Papers present design case studies; reference designs; design methodologies, tools, and techniques; and other topics of immediate interest to practicing engineers. The DesignCon Technical Program Committee, a group of leading practitioners from the semiconductor and electronic-design communities, is responsible for developing the Call for Papers and selecting the papers presented at DesignCon.
Conference Panels
The Technical Program Committee also develops the popular panel discussions on critical design issues. These panels are offered on a complimentary basis to all DesignCon attendees at the end of each day's program.
Complimentary Education
In addition to the paid conference programming, complimentary educational programming is also available to all DesignCon attendees. Complimentary programming includes access to keynote addresses, plenary panels, and conference panels.
Management Forum
Industry executives share their perspectives on current challenges in this program designed for senior engineering managers and executives. Key executives attend the Management Forum and the exhibition as a guest of the IEC.
For more information on the opportunities available, please contact Christine Paplaczyk at +1-312-559-4616 or cpaplaczyk@iec.org.
DesignCon 2007 Home | DesignCon 2007 Prospectus Overview
