| Booth #725 | ![]() |
Painesville, OH USA phone: 440-354-3148 fax: 440-354-0687 www.meritec.com |
TECHNOLOGIES ON DISPLAY
·Card Edge I/O Cable Assembly (PCIe Format)
Meritec is developing a Card Edge I/O assembly capable of running at 5Gbs per lane exceeding both PCIe and InfinibandTM
specifications. Utilizing industry standard X8 PCIe card edge layout, this cable connector mates directly to the PCB and
can be populated with up to 12 lanes (24, 100 ohm, differential pairs) while eliminating the need for a board receptacle.
This design is expandable to 16 lanes with good crosstalk characteristics and minimal signal degradation. Utilizing proven
welded terminations directly attaching the wire to card edge contacts without the use of an interstitial PCB provides for a
clean electrical path within the termination. The rugged die-cast backshell, secured with thumbscrews, offers complete EMI
shielding.
·Tight Fit (90° Z-Axis) 4X Cable Assemblies
Meritec, originator of the 4X (SFF-8470) angled egress termination that minimized space requirements within blade servers and switch boxes, has introduced a new termination design that will further facilitate space savings. The new 90° Z-Axis provides the packaging engineer new alternatives when connecting box to box with spacing requirements as little as 1U (1.75"). Designed to allow for door clearances of less than 2 inches, the 90° Z-Axis termination enhances the packaging engineer's ability to cleanly route his/her cabling requirements my minimizing both cable lengths and space the cables would otherwise require. The 90° Z-Axis termination utilizes a rugged die-cast backshell providing for complete EMI shielding and is solidly retained by thumbscrews.
·Zero Insertion Force (ZIF) Connectors
The use of ZIF connectors in Automated Test Equipment (ATE) eliminates the need to overcome high insertion forces and reduces the need for stiffening components to maintain planarity. Joy Signal Technology, in partnership with Meritec, has developed technologies that allow ZIF connectors to be used in very high pin count applications, like those typically encountered in the ATE industry. This new ZIF connector technology can be accomplished while still maintaining high contact density and signal integrity. The benefits of this design can significantly lower the cost per pin normally associated with traditional approaches based on spring probe contacts.













