| Booth #836 | ![]() |
Burnsville, MN USA phone: 952-229-8218 fax: 952-229-8201 www.ironwoodelectronics.com |
TECHNOLOGIES ON DISPLAY
·High Performance BGA Socket
Chip Size, High Endurance, 10 GHz Socket for 1.0mm Pitch IC. 30X30 array IC's to be used in socket and operate without compromising performance in very high bandwidth applications. The new 10 GHz bandwidth sockets support the very dense pitch BGA devices in a 500,000 actuations socket. The socket is designed to dissipate up to 7 watts without extra heatsinking and can handle up to 60 watts with custom heatsink. The contact resistance is typically 30 milliohms per ball. The SS-BGA772A-01 is constructed with high endurance spring pins (pogo) with endurance rated at 500,000 actuations. The temperature range is -40 C to +150C so it can be used to test the product over burn-in and high temperature test applications.
·High Endurance 10.0 GHz Socket
New high performance socket-SG-QFE-7000 allows 0.4mm pitch, 14mm body, power pad QFP IC's to be used in socket and operate without compromising performance in very high bandwidth applications. Constructed with high performance and low inductance elastomer. The temperature range is -35 C to +85C.
·Probing Adapter for 48 Pin QFN
New high performance Probing Adapters allow probing of 48 pin QFN's with logic analyzers such as the Agilent 167XX or Tektronix TLA7XX. These adapters are compatible with 7mmx7mm, 0.5mm pitch QFN's.













