| Booth #521 | ![]() |
Etters, PA USA Phone: 717-938-7200 Fax: 717-938-7527 www.fciconnect.com |
TECHNOLOGIES ON DISPLAY
·HCITM Power Distribution System
The HCITM connector system anticipates increasing system power demands that are driving the need for greater
power density. A single power contact accommodates over 90 amps based on 30°C temperature-rise with zero airflow.
The high current-carrying capacity and a robust, molded-in guidance system are ideal for high-wattage, blind-mate power
supplies. Available HCITM configurations support standard coplanar and backplane interfaces.
Integrated HCITM power connector solutions, enabling power and signal contacts in a single molded housing,
also offer incredible flexibility to address requirements for custom configurations. The connectors feature cost-effective
stamped contacts, vented insulators to optimize airflow through the connector to carry heat away from the contact surfaces,
and the lowest product height among comparable high-current connectors.
·AirMax VS® Power Modules
Compact AirMax VS® power modules from FCI provide increased current-carrying capacity for both backplane and co-planar
applications. Each contact in a 1x2 connector module is designed to carry a maximum of 40 Amps, or a total of 80 Amps per
module. Individual contacts in the 2x2 or 2x3 modules are designed to carry a maximum of 20 Amps. Standard-profile 1x2
and 2x2 right-angle modules stand 14.7mm above the top surface of the carrier PCB. New lower-profile 2x2 and 2x3 modules
match the 11.5mm above-board height of AirMax VS® 3-pair signal connectors, which enable the power modules to be
employed on 16.7mm card slot pitch or as a means to increase air flow in a chassis having wider slot spacing.
·MicroTCATM Card Edge Connectors
MicroTCATM vertical card-edge connectors provide 170 contacts on 0.75mm pitch and enable AMCTM
cards to be plugged directly to a backplane. Both press-fit and surface-mount (SMT) termination options are available.
Metal retention clips on the SMT connectors provide additional mechanical strength after soldering. FCI connectors are
in full compliance with the MicroTCATM standard. The press-fit version accommodates speeds up to 10 Gb/s,
and the SMT version supports speeds of 10 Gb/s and beyond. The MicroTCATM standard, developed within PICMG®,
creates a physically small but very powerful system in 4U height and 300mm depth. The reduced size and cost are suitable
for wide range of applications such as core routers, IP-gateways, base stations, switching centers, and customer premises
equipment.













