| Booth #707 | ![]() |
Lombard, IL USA phone: 800-323-9612 fax: 630-705-6059 www.cinch.com |
TECHNOLOGIES ON DISPLAY
·Cinch iQ Interconnect Technology
Cinch's solderless iQ compression connector technology more than matches the high-speed, high-I/O and high-density challenges of today's applications. The short signal path produces low self-inductance, minimal cross talk, and low resistance for high-speed, high-density interconnects. Innovative "floating" Q-shaped contacts provide a large working range, low compression forces, and adjust for uneven planarity. The versatility of the iQ technology, along with its excellent mechanical and electrical characteristics, make it ideal for a wide range of applications, such as LGA, flex circuits, board-to-board, and component-to-board types.
·Cinch iQ Flex Circuit Assembly Solution
Cinch Connectors offers a solderless, board-to-board, compression style interconnection solution that blends the Cinch iQ connector with a flex circuit and compression system. The Cinch iQ Flex Circuit Assembly Solutions are designed for a variety of board-to-board applications, such as co-planar, parallel, stacked, multi-level and backplane boards. With a large I/O interconnect range, the ability to match custom footprints, and a pitch as low as 1 mm, Cinch is making it easier for designers to create multi-board solutions tailored to their exact requirements. The high-speed, low-profile, Cinch iQ technology can handle higher-speed signals and allows designers to optimize space on their printed circuit boards. Also, the solderless compression system is easy to use and permits fast rework.













