Mike Splain, Sun Fellow, CTO & Chief Technologist, Scalable Systems Group, Sun Microsystems

Maria Agoston, Principal Engineer, Tektronix Rami Ahola, Technical Marketing Manager, Mentor Graphics John Andresakis, Vice President, Strategic Technology, Oak-Mitsui Technologies Michael Annand, Interconnect Technologist, W.L. Gore & Associates Bruce Archambeault, Distinguished Engineer, IBM Brian Bailey, Chief Technologist, Poseidon Design Systems Ramesh Banda, Senior Member of Technical Staff, Agere Systems Dana Bergey, Signal Integrity Manager, FCI J.Bhasker, Architect, eSilicon Corporation Ajay Bhatia, Director, Montalvo Systems Tim Blackmore, Staff Verification Engineer, Infineon Technologies Ken Braund, Sales & Marketing Manager, Meritec David Brunker, Technical Fellow, Molex Sergio Camerlo, Independent Consultant Robert Carter, Oak-Mitsui Technologies Jinhua Chen, Consulting Design Engineer, EMC Corporation Wheling Cheng, Technical Leader, Cisco Systems Megan Chura, Agilent Technologies Brad Cole, Co-Founder, Ultimetrix John D'Ambrosia, Ethernet Ecosystem Architect, Force10 Networks Jim DeLap, Application Engineer, Ansoft Corporation Suveer Dhamejani, Business Development Manager, Tyco Electronics Joseph Diepenbrock, Senior Technical Staff Member, IBM David Dunham, Electrical Engineering Manager, Molex Mazlina Esa, Associate Professor, Universiti Teknologi Malaysia Jun Fan, Senior Hardware Engineer, NCR Corporation Saverio Fazzari, Consultant Harry Foster, Principal Engineer, Mentor Graphics Michael Fowler, Principal Strategic Marketing Engineer, Fairchild Semiconductor John Grebenkemper, Signal Integrity Engineer, Hewlett-Packard Brett Grossman, Technologist & Sr. Staff Engineer, Intel Robert Haller, Hardware Architect, Enterasys Amir Hekmatpour, Senior Engineer, IBM Richard Ho, D.E. Shaw, Research LLC Ching-Chao Huang, President, AtaiTec Alfonso Iniguez, Design Engineer, Freescale Semiconductor Karl Kachigan, Signal Integrity Program Manager, Agilent Technologies Sunil Kakkar, Senior Staff Enginer-Manager, Qualcomm Isaac Kantorovich, Senior Hardware Engineer, Intel Sunil Khatri, Assistant Professor, Texas A&M University Andrew Kim, Senior Systems Architect, Quellan Ravi Kollipara, Senior Principal Engineer, Rambus Brock LaMeres, Assistant Professor, Montana State University Greg Le Cheminant, Product Manager, Agilent Technologies Mike Peng Li, Chief Technology Officer, Wavecrest Christopher Loberg, Market Segment Manager, Tektronix Vasanta Madduri, Technical Marketing Manager, National Semiconductor Henri Maramis, Manager, Signal Integrity Engineering, Intel

Daniel Martin, Senior Application Engineer, Catalytic Greg Martin, Product Applications Engineer, LSI Logic Andrew Martwick, Circuit Architect, Intel Norio Matsui, President and Chief Executive Officer, Applied Simulation Technology Steven McKinney, Technical Marketing Engineer, Mentor Graphics Herve Menager, SoC Architect, NXP Semiconductors Jason Miller, Staff Engineer, Sun MicroSystems Ozgur Misman, Substrate Co-Design Manager, Amkor Technology John Mitchell, Director of Applications, Quellan Eric Montgomery, Manager, Signal Intergrity, Northrop Grumman James Nadolny, Senior SI & EMI Engineer, Samtec Alfred Neves, Senior Staff Engineer, Teraspeed Consulting Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems Tom Pitten, Vice President, Development Engineering, Amphend TCS Andrew Piziali, Verification Application Specialist, Cadence Design Systems Rainer Plitschka, Application Consultant, Agilent Technologies Jonah Probell, Independent Consultant Peter Pupalaikis, Principal Technologist, LeCroy Corporation David Quint, Master Engineer, Hewlett-Packard Suresh Rajgopal, Senior Principal Engineer, STMicroelectronics Michael Resso, Business Development Manager, Agilent Technologies Woong Ryu, Staff Analog Engineer, Intel Edward Sayre, President and Chief Executive Officer, North East Systems Associates Christian Schuster, Professor Technical University of Hamburg-Harburg Hong Shi, MTS Packaging Technology, Altera Kaijian Shi, Principal Consultant, Synopsys Leena Singh, Verification Architect, Rambus Dima Smolyansky, Director, Tektronix Mike Stahl, Design Technology Scientist, Hewlett-Packard Ransom Stephens, Research Scientitst, Teraspeed Consulting Suresh Subramaniam, Member of Technical Staff, Cswitch Timothy Swettlen, Technologist & Staff Engineer, Intel Lars Thon, Member of Technical Staff, Aeluros Peter Tomaszewski, Scientist, SI & Packaging, Force 10 Networks Ken Umino, Staff Consultant, Synopsys Kumar Venkatramani, Executive Consultant, SoftJin Infotech Pvt. Ltd. Michael Vrazel, Technical Director, Quellan Min Wang, Senior Signal Integrity Engineer, Intel Kathy Werner, Reuse Manager, Freescale Semiconductor David Whipp, Senior Verification Engineer, NVIDIA Mike Wondolowski, Principal Engineer, Zebra Technologies Song Wu, Senior Member Technical Staff, Texas Instruments Xiaodong (Luke) Wu, Engineer, Texas Instruments Zhiping Yang, Principal Signal Integrity Engineer, Nuova Systems Mobashar Yazdani, Manager-ASIC/ASSP Technology Center, Hewlett-Packard Ping Yeung, Product Manager, Mentor Graphics Arch Zaliznyak, Senior Member Technical Staff, Altera Iliya Zamek, Member Technical Staff, Altera Jared Zerbe, Director of Engineering, Rambus