Poster sessions enable increased personal interaction between presenters and the audience and are well-suited to introducing new technologies and concepts. Posters will be displayed on the exhibition floor, and authors will tend and present their posters during the Exhibitors' Reception, from 4:45 pm to 6:30 pm on Tuesday and Wednesday.

Poster topics will include the following:

• 3D packaging technologies
• Advanced interconnect technologies
• System-in-package (SiP) design
• Wafer-level testing