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Connecting the World of Electronic Design
InfoVault Publications DC Home
DesignCon 2007
Register Today
Call for Posters
Abstract Deadline: November 17, 2006
Poster Session: January 30–31, 2007

The International Engineering Consortium is pleased to announce this Call for Posters for DesignCon 2007, the premier educational conference and technology exhibition for semiconductor and electronic design engineers. At DesignCon, engineers talk to engineers to find practical solutions to the challenging problems they share in design and verification. We emphasize education and peer-to-peer sharing among practicing engineers, creating a unique atmosphere for learning about state-of-the-art design methodologies and technologies.

Poster sessions enable more personal interaction between presenters and the audience and are well-suited to introducing technologies and concepts for which the audience's background is limited or highly varied. To allow presentation of the most current ideas and results, poster authors are not required to prepare papers for the DesignCon Conference CD.

The Poster Session at DesignCon 2007 will be held in the exhibition hall. Posters will be on display throughout the exhibit hours of 12:30 pm – 6:30 pm on Tuesday and Wednesday, January 30–31. Authors will tend and present their posters during the Exhibitors' Reception, from 4:45 pm – 6:30 pm on Tuesday and Wednesday.

A list of suggested poster topics appears below. To submit a proposal, prepare a 100-word abstract and complete the on-line submission form on the DesignCon Web site by November 17, 2006. Submissions will be reviewed based on quality, relevance, educational value, and originality. Prospective authors are welcome to reference products as long as product references add to the educational value and are presented in an appropriately noncommercial fashion. Product demonstrations are not appropriate for poster presentations.

Example Topics
  • 3D packaging technologies
  • Advanced interconnect technologies
  • Biologically based electronic systems
  • Electronic system-level (ESL) design
  • Embedded passives design for PCBs
  • Flexible electronics
  • Design for manufacturing (DFM)
 
  • MEMS design and applications
  • Molecular and organic electronics
  • Nanoelectronic devices and structures
  • Nanometrology
  • Single-wafer manufacturing
  • System-in-package (SiP) design
  • Wafer-level packaging
All relevant proposals—including topics other than those listed—will be considered.


For More Information Contact:
Barry Sullivan
DesignCon 2007 Conference Director
+1-312-559-4127 fax
bsullivan@iec.org
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