Highlights | Schedule | Exhibitor List

Patrick Yu, Director, Technical Marketing, A Li Microelectronics
Ed Liu, Director, RF Engineering, NVIDIA
Baker Scott, Director, Engineering, RF Micro Device
Noman Rangwala, Product Marketing Engineer, Analog Devices
Ken Buttle, Engineering Director, Nimbus Wireless

Part of the Wireless Technology Feature at DesignCon, this TecForum offers a comprehensive view of two interface standards. These standards define how the lower-MAC and upper-MAC, as well as the baseband and the radio transceiver, can be connected in terms of functional partitioning at both ends of the interfaces, of the electricals of the interfaces, and of the protocols used for communications between the two ends of the interfaces. In addition, the TecForum provides a systematic view of the interface standards and their strengths, a view that is implementation specific and includes gate count and suitable process technologies.