2004 Archive
Highlights | Schedule | Exhibitor List
TF10
Monday, February 2 | 1:00 pm - 4:00 pm
Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects
Brian Vicich, Advanced Design Group Engineering Manager, SamtecScott McMorrow, President, Teraspeed Consulting Group LLC
Tom Dagostino, Vice President, Modeling, Teraspeed Consulting Group LLC
This TecForum presents hybrid design, modeling, simulation, and measurement techniques that reduce risk in high-performance designs of 10 Gbps and above. The presenters discuss the importance of modeling that is appropriate to the system elements being modeled, including high-accuracy stripline trace modeling with the Synopsis Hspice W-element table model, full-wave three dimensional modeling for vias, connector transitions and SMA launches, and lumped element versus S-parameter modeling for connector cross sections.
