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Andrew Byers, Hardware Design Engineer, Microelectronics, Tektronix

Interconnect performance is rapidly becoming the most limiting factor in many high-speed electrical system designs. As data transmission rates climb, so do the losses and reflections caused by interconnect structures such as transmission lines, vias, wirebonds, connectors, and BGA transitions. This paper analyzes an interconnect transition from a PCB environment to the package, or interposer, environment. The electrical package is mounted on the PCB with BGA technology, and low-loss dielectric materials are used in the package and the PCB. Careful design, simulation, and measurments are required to ensure that this BGA transition is as clean as possible in order to minimize unwanted reflections.