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John Mitchell, Senior Application Engineer, Northrop Grumman, Winchester Electronics and Interconnect Technologies Divisions
Bodhi Das, Staff IC Design Engineer, Xilinx

In the last 12 months, 10-Gbps serial data transmission in copper backplanes has moved from being a good possibility to a practical reality. Advancements both in active signal conditioning and passive interconnect technologies have made this happen. Today it is feasible to build, in volume production, a long-reach multiple channel copper backplane that can deliver an aggregate bandwidth of hundreds or thousands of Gbps over copper. The doubts and concerns regarding the manufacturability of such a backplane have been erased through hard evidence. This paper presents one such evidence.