Developed specifically for semiconductor and electronic design engineers, DesignCon is the essential design engineering event addressing the challenges facing these communities and providing the solutions attendees can implement immediately in their designs.

The DesignCon Technical Program Committee selects technical papers to be presented by professionals at the top of their field to discuss leading-edge case studies, technology innovations, practical techniques, design tips and application overviews.

40-minute presentations will provide attendees with in-depth perspectives in the following technical tracks:

• Chip-Level Functional Design
• Chip-Level Physical Design and Verification
• Power and Package Co-Design
• PCB, Package, and Passive Technologies
• Chip and Board Interconnect Design
• High-Performance Backplane Interconnect Design
• High-Speed Timing, Jitter and Noise
• Power Integrity
• Functional Verification
• Business Issues

Conference Catalog (PDF)

See what happened at previous DesignCons
2006    |    2005    |    2004    |    2003    |    2002    |    2001    |    2000    |    1999