The DesignCon Technical Program Committee selects technical papers to be presented by professionals at the top of their field to discuss leading-edge case studies, technology innovations, practical techniques, design tips and application overviews.
40-minute presentations will provide attendees with in-depth perspectives in the following technical tracks:
- Chip-Level Functional Design
- Chip-Level Physical Design and Verification
- Power and Package Co-Design
- PCB, Package, and Passive Technologies
- Chip and Board Interconnect Design
- High-Performance Backplane Interconnect Design
- High-Speed Timing, Jitter and Noise
- Power Integrity
- Functional Verification
- Business Issues
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Conference Catalog (PDF)
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