Contact: Lisa Reyes
Phone: +1-312-559-3325
E-mail: lreyes@iec.org
IEC announces first DesignVision recipients at DesignCon; award recognizes leading products and services in electronic design
Santa Clara, Calif - Feb. 1, 2005 -- The International Engineering Consortium (IEC) today announced the electronic design and semiconductor companies who are the recipients of the first DesignVision Awards.
The awards were announced in a ceremony at the DesignCon educational conference and technology exhibition, which takes place through Thursday at the Santa Clara Convention Center. The IEC is the presenter of DesignCon. DesignVision honors were presented to 19 companies and organizations in 10 categories. Recipients were selected based on innovation, uniqueness, market impact, customer benefits and value to society.
"As the leader in providing educational opportunities to the electronic design industry, the IEC is proud to recognize these companies for their ingenuity and service," IEC Senior Director John Janowiak said. "Based on these honorees, you can tell the spirit of innovation that has always fueled the electronic design and semiconductor industry is still going strong."
The IEC plans on making the DesignVision Awards an annual fixture at DesignCon.
The 2005 Design Vision recipients are:
Category: ASIC and IC Design Tools
Cadence Design Systems for Cadence First Encounter Global Physical Synthesis
Synplicity for Amplify family of Structured / Platform ASIC Synthesis products
Design Verification Tools
Novas for Verdi Behavior-Based Debugging System
Synopsys for Magellan Hybrid Formal Verification Tool
FPGA and PLD Design Tools
Xilinx for Platform Studio
Industry Service
Accellera for Property Specification Language (PSL) version 1.1
VSIA for VSIA Quality IP Metric
Interconnect Technologies and Components
FCI for AirMax VS Connector System
PCB Design Tools
Samtec for Final Inch
Semiconductors and ICs
Analog Devices for VisualAudio Graphical Audio System Design and Development Environment
National Semiconductor for Point-to-Point Differential Signaling Arch and Chipset
NEC Electronics for 90-nm ISSP Device
Semiconductors and ICs / IP category
Virtual Silicon Technology for Mobilize Power Management IP
Structured / Platform ASIC Design Tools
eASIC Corp. for Structured eASIC
AMI Semiconductor for XPressArray-II
System-Level Design Tools
Amherst System Associates for M1 Timing and Jitter Analysis Timing Software
Test and Measurement Equipment
Agilent for Infinium DSO80000 Series Oscilloscopes and Inifimax II Series
Tektronix for TDS5000B with Myscope
Wavecrest for SIA 3600 D Signal Integrity Analysis Solution
The presenter of DesignCon and the DesignVision Awards, the International Engineering Consortium (www.iec.org), is a non-profit organization dedicated to catalyzing positive growth in several industries and their university communities. Since 1944, the IEC, which is headquartered in Chicago, Ill., has provided high-quality educational opportunities for industry professionals, academics, and students. The IEC also produces publications and handles the affairs of the Electrical and Computer Engineering Department Heads Associations and Eta Kappa Nu, the honor society for electrical and computer engineers.