ISI specializes in electronic modules. We have a broad set of capabilities including high-density PCB design, fine pitch SMT, flip chip and wirebond assembly, and packaging. We have unique module interconnect solutions including BGA, leadframe, PGA and Micro-PGA. Our HiLo Interconnect System is used for high performance BGA socketing and board-to-board interconnect. Products include IC Packages, Cost Reduction Modules, IC Footprint Conversion Adapters, Flex Circuit Assemblies, and Bare Die to PCB or Flex.