Hirose is a worldwide technology leader founded in 1937 that specializes in high-speed backplane and mezzanine interconnection systems, along with electronic, RF and fiber connectors. Hirose is continually designing innovative products including high-density/high-speed BGA, right angle/ high-density optical backplane, and ultra-small and high-performance RF connector systems. Please visit www.hirose.com to see our full offering of Creative Links to World Electronics

The All-In-One HX2 backplane connector system from Hirose provides scalable speeds from 2.5 to 10+ Gb/s while providing the industries highest signal density with up to 78 real differential pairs per linear inch (in a 1 inch card slot). With its ability to be mounted in either press-fit or BGA (Pb or Pb-Free), the ability to have differential pair, single ended, and power all in one package and, its reverse gender "to pin to bend" design, the HX2 series connector is truly a connector that can grow with your system.

The IT2 mezzanine connector system from Hirose provides a true and reliable 10 Gb/s board-to-board interface. With its unique three-piece design, IT2 ensures reliable BGA (Pb or Pb-Free) soldering during reflow regardless of stacking height. Interposer technology means better impedance matching, lower dielectric loss, and the ability to have differential pair, single ended, and power all in one package. Dual beam contact design gives a reliable interface. IT2 offers all the above features in stacking heights ranging from 15mm to 50mm.

The 3D Optical Waveguide OE/EO device from Hirose provides the customer with a high performance and high-density right angle optical interface. The interconnect system offers features such as arrayed multi-channel optical I/O's, zero skew, connectivity to martix arrayed optoelectronics, low insertion loss, and SMT process compatibility.