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Exhibitor List

Austin, TX USA
phone: 512-306-9299
fax: 512-306-8717
www.icepak.com
Fluent Inc.
Booth #908

The Icepak division of Fluent focuses on delivering quality high-performance design tools for the electronics industry. Icepak's suite of design and analysis software offerings currently encompasses ICEPAK, the leading electronics thermal design tool, ICEMAX, the most advanced parasitic extraction tool for complex IC package designs and ICEWAVE, a new, time-domain 3-D full wave simulation tool for EMC/EMI analysis of electronic products.

· ICEMAX
ICEMAX™ is the most advanced parasitic extraction tool for analyzing complex IC package designs. ICEMAX is based on state-of-the-art finite volume field solver technologies, which allow quick and accurate electrical characterization of IC package performance. Package designers, engineers and researchers involved in IC package design can now easily generate detailed, reliable RLC information for the entire package in a matter of minutes. Output can be generated in matrix, SPICE, or IBIS formats. ICEMAX 3.0 comes with new features specifically for System-in-Package (SiP), Package-in-Package (PiP) and Package-on-Package(PoP) designs.

· ICEWAVE
Product Description: ICEWAVE™ is a time-domain 3-D full wave simulation tool for EMC/EMI analysis of electronic products. ICEWAVE uses a robust finite-difference time-domain (FDTD) field solver to solve complex real-world EM radiation and propagation problems. With easy import from CAD and ICEPAK thermal design tools and an easy-to-use, intuitive user interface to build complicated models, ICEWAVE allows users to prototype electronic products based on numerical simulations in their design flow for faster and reliable designs of high-performance products.

· ICECHIP
Product Description: ICECHIP is a stand-alone tool for component level analysis that allows IC package designers to perform thermal simulations with ease. A smooth process of importing relevant geometry and subsequent processing facilitates analysis of existing package designs as well as what-if analysis. ICECHIP can import package stack-ups from EDA software like Cadence APD, Synopsys encore or layouts from dwg/dxf format files. ICECHIP also exports ICEPAK model files.