eASIC offers breakthrough Programmable ASICs including Configurable Logic IP and Structured ASIC products. Its patented architecture enables fast-turn and low-cost ASIC designs by innovative use of programmable logic fabric combined with single-via customizable segmented routing. Using Direct-write eBeam maskless technology allows eASIC to offer NRE-free Structured ASICs. STMicroelectronics implemented eASIC's fabric in programmable SoC platform. eASIC is fabless, privately held and venture-backed by Vinod Khosla, KPCB, Crescendo and Evergreen. Headquartered in Santa Clara, California, eASIC was founded in 1999.

FlexASIC™ is a Structured ASIC family, manufactured on a 1.2-V, 0.13-micron CMOS process, powered by eASIC's patented technology. FlexASIC devices drastically reduce ASIC development cost and turnaround times and provide designers with densities, performance, and power-consumption competitive with Standard Cell.

This breakthrough concept combines configurable Look-Up-Table cells with single-via customized interconnect. The interconnect can be customized quickly and inexpensively with a maskless lithography approach using Direct-write eBeam equipment. Printing directly on the wafer using eBeam eliminates NRE fees as no custom-masks are required. This approach is ideal for prototypes and low-volume, while a single via-mask is used for high-volume production, generating identical chips.

FlexASIC design flow uses Magma's tailored tool set for Structured ASIC.