The DOLPHIN Integration Group provides a three-tiered offering of Silicon IP, EDA Solutions and SoC Integration services to meet the Time-To-Fab challenge through a really hierarchical flow ensuring IC's right-on-first-pass. State-of-the-art Virtual Components for embedding Logic, Analog and Memory, provide low dynamic and static power-consumption, enabling Codecs for multimedia applications whatever the surrounding SoC noise. Multi-lingual simulator SMASH uniquely provides diagnostic efficiency and speed in Virtual Characterization of mixed signal circuits.

We are glad to inform you that a new generation of Voice CODEC - voCODlv - is now available for designing SoCs. Its amazing density, less than 1 mm2 for the whole CODEC including Input/Output amplifiers and logic circuitry, ensures a high return from integration also considering that it is fabricatable with a pure logic process with core transistors!

As its specifications have been optimized for meeting the needs of applications as various as VoIP, Bluetooth headset, mobile phone, hand free speakers, PDA, toys… voCODlv feature a very low power consumption.

Enabling leakage savings in the range of 1/1,000 over traditional designs, Dolphin's RAMs and cells to a new standard, based on the breakthrough design innovation of patent "Thick'n Thin", offer the best answer in terms of static power consumption. In a pure logic and General Purpose 0.18 um CMOS process using generic transistors, the leakage of a RAM instance of 8kx8 is as low as 2 nA and the leakage of a 100k-gate logic bloc is as low as 0.3 nA.

Then, depending on the SoC content, battery-life can be increased by a factor of 2 to 10 by replacing any Silicon IP by Dolphin's library of memories and standard cells!

Get an optimal return-on-investment with Flip80251 Typhoon thanks to:

A Complete SoC Integration Platform is available, from HW/SW co-design and co-verification solution to Hardware and software emulators.