Complete DVT Solutions is an independent signal integrity consulting company founded by Jim Mayrand and Brian Shumaker. We provide expert measurement services and new interconnect products to support the development of high frequency digital interconnect systems and models from 10-40Gbits. We are commercializing advanced military interconnect technology enabling companies to break the 10Gbit digital barrier for real time digital processing. Services include IConnect application development and training, 30 GHz socket and 30 GHz Differential TDR probe.
· DVT30-1MM Gigaprobes tm
DVT30-1MM GigaProbesTM are 30GHz 100§Ù Differential TDR Probes with a typical differential launch discontinuity of <20mv and a fall-time of 20ps. These probes masks less than 20mils of the device under test. This small discontinuity mask is most important when characterizing IC packages where net lengths can be very short. The DVT30-1MM comes with a set of ergonometric grips for comfortable hand probing and easily attach to Probe Station micromanipulators; providing a 2 inch, low profile, wide band reach. The Signal-to-Signal pitch can be set to .5mm, 1mm or 2mm using a custom designed SMA wrench. The pitch can also be customized using other tools supplied in the DVT30-1MM GigaProbes accessory kit.
· 30GHz Diamond Interconnect Socket
These chip carriers can be reinserted without pogo pin sockets for speed grading and for other DVT application use military grade nickel coated multipoint diamond contacts. The impact on signal integrity is virtually zero with no inductance, no capacitance, and only a 1 % increase in impedance up to 30GHz and beyond. The socket is able to withstand dirt, oils, humidity, and up to 26Gs of vibration and shock. Temperature dependence of the socket is determined by which substrate material is used; FR4 is good from –40C to 150C, Kapton film operates from –55C to 200C and a crystalline substrate can be used in temperatures as low as 4K to 400C.
· GP10CS 10 GHz Calibration Substrate
This Calibration substrate can be used with any TDR or VNA probe with a 1 mm S-S or S-G pitch. This is the world's first calibration substrate using Diamond Particle Interconnect. The calibration substrate pad resists bandwidth degradation from grease or contaminates or handling and requires less than 10 grams of contact force to make DC to 10GHz return loss bandwidth. This hand probe calibration substrate is used with TDR and VNA test instruments to calibrate 100 ohm differential or 50 ohm single ended probes for s-parameters measurements using Tektronix IConnect software.




































