Why are you using 2D layout tools to design 3D technologies? CAD DESIGN SOFTWARE (CDS), an EDA Software developer, offers complete 3-D EDA Layout tools for IC Packaging, IC Test, RF/Microwave, Hybrid/MCM, and advanced printed circuit boards. Master Foundry Designer for IC packaging includes BGA, Stack-die, CSP, SiP, Flip-chip, Lead-frame, Master IC Test Designer supports Probe Card, Load Board, and Burn-in Boards, and Master PCB Designer focuses on advanced PCB layout (RF/Microwave, Hybrid/MCM, Flex, Digital/Analog).

Bond Wire Optimizer is powerful 3-D package layout software that brings true 3-D design to the IC packaging engineer. Now, in addition to full electrical DRC, the layout designer can perform a wide array of 3-D clearance and tolerance checks for optimizing the design for manufacturing. BWO generates a 3D image of complex designs and calculates clearances between bondwires in 3D. Each die are automatically moved and rotated to placement maximum tolerances. Then clearances between bondwires, capillary, and die at each tolerance combination are calculated.

Bond wire profiles are read in from libraries or created. In addition, capillary designs can be read in or created utilizing the included Capillary Design tool, and capillary-to-wire clearances can also be checked.

Master IC Test Designer is a technology-specific set of tools for advanced Probe Card, Load Board, and Burn-in Board layout designs.

• Parameter driven controls for easy creation of test sockets, complex components, and BGA patterns
• Automatic tuning programs using trombone or accordion tunes
• Polar based routing to optimize area on radial designs
• Automatic pre-routing of BGA patterns
• High-speed netlist creation and optimization of layers for routing
• Automatic probe placement ensures optimum probe needle design
• Automatic die/wafer creation from X.Y coordinates, from drawing data, or from parameters
• Automatic probe via arrays with power rings
• Advanced ground plane generation for complex and/or split planes
• Intelligent blocking and array system for cells, with intelligent reference control
• Automated creation of burn-in cells
• Automatic routing utilities for pattern reuse