Jun Fan
Senior Hardware Engineer
NCR Corporation
Dr. Fan received his B.S. and M.S. degrees in electrical engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively. He received his Ph.D. in electrical engineering from the University of Missouri-Rolla in 2000. He currently is an employee of NCR Corporation and serves as a senior hardware engineer. His research interests include signal integrity and EMI designs in high-speed digital systems, dc power bus modeling, PCB noise reduction, differential signaling, and cable/connector designs. He received the Conference Best Paper Award from the Applied Computational Electromagnetics Society in 2000.
Zhiping Yang
Principal Signal-Integrity Engineer
Apple Computer
Before he joined Apple Computer, Dr. Yang was a technical leader at Cisco Systems, Inc. His research interests include the signal- and power-integrity methodology development for die/package/board co-design and high-speed differential signaling technology. He holds a Ph.D. in electrical engineering from the University of Missouri-Rolla.
Bruce Archambeault
Senior Technical Staff Member
IBM
Dr. Archambeault is a senior technical staff member at IBM in Research Triangle Park, North Carolina. He received his B.S. in electrical engineering from the University of New Hampshire in 1977 and his M.S. in electrical engineering from Northeastern University in 1981. He received his Ph.D. from the University of New Hampshire in 1997. His doctoral research was in the area of computational electromagnetics applied to real-world EMC problems. In 1981, he joined Digital Equipment Corporation, and through 1994, he had assignments ranging from EMC/TEMPEST product design and testing to developing computational electromagnetic EMC-related software tools. In 1994, he joined SETH Corporation, where he continued to develop computational electromagnetic EMC-related software tools and used them as a consulting engineer in a variety of different industries. In 1997, he joined IBM in Raleigh, North Carolina, where he is the lead EMC engineer, responsible for EMC tool development and use on a variety of products. During his career in the U.S. Air Force, he was responsible for in-house communications security and TEMPEST/EMC related research and development projects.
Nozad Karim
Vice President, Application Engineering and Characterization
Amkor Technology
Mr. Karim leads worldwide electrical, thermal, and mechanical engineering teams. He has been with Amkor since 1997. He has nearly 27 years' experience working with semiconductor packaging, system in package, and circuit and system designs for digital, analog, and RF/microwave applications. Mr. Karim holds a B.S. in electrical engineering from the State University of New York at Buffalo and an M.S. in electrical engineering from Southern Methodist University at Dallas. Mr. Karim was appointed to the Arizona State University Polytechnic Campus' Industry Advisory Board in 2002.
Eric Montgomery
Signal-Integrity Manager, Interconnet Technologies
Northrop Grumman
Mr. Montgomery has 25 years' experience as the signal-integrity manager with Interconnect Technologies. He holds a B.S. in physics from Southwest Missouri State University, as well as advanced courses in electrical engineering from the University of Tennessee, the University of Colorado, and Stanford University. He has served on the IPC Test Committee, directed the optical backplane development program for Northrop Grumman's Interconnect division, and presented the optical backplane program at the Optical Fiber and Communication Conference (OFC) and DesignCon. Mr. Montgomery's expertise is in the design and development of new transmission-line methods and coupling techniques for high-speed signal processing.
Istvan Novak
Senior Staff Engineer
Sun Microsystems
Mr. Novak is signal-integrity senior staff engineer at SUN Microsystems, Inc. Besides signal-integrity design of high-speed serial and parallel buses, he is engaged in the design and characterization of power-distribution networks and packages for workgroup servers. He creates simulation models and develops measurement techniques for power distribution. Mr. Novak has 20+ years of experience with high-speed digital, RF, and analog circuit and system design. He is a fellow of IEEE for his contributions to the signal-integrity and RF measurement and simulation methodologies.
Joel Peiffer
Lead Engineering Specialist
3M
Mr. Peiffer received his B.S. in materials science from the University of Minnesota in 1982. He is currently employed by 3M in St. Paul, Minnesota, as a lead engineering specialist in 3M's Electronic Solutions division. His current position is working as an applications engineering specialist for 3M's embedded capacitor laminates. Since 1996, he has been responsible for the development and commercialization of 3M embedded capacitor materials. His previous work includes more than 20 years of experience in printed circuit board and electronic packaging manufacturing. Prior to his employment at 3M, Mr. Peiffer was employed at BMC Industries, Hutchinson Technology, Century Circuits, and Digital Equipment.
Hong Shi
Lead Electrical Engineer, Packaging Technology Group
Altera
Dr. Shi is lead electrical engineer in the Packaging Technology group of Altera. His current responsibilities include developing strategy for high-density and high-performance FPGA packaging, simulating system-level electrical performance, and developing chip-package-board interconnect co-design capability. Before joining Altera, Dr. Shi was with HP and later Agilent Technologies. He was principal engineer and project leader for Agilent's first 40-Gbps digital communications analyzer module. Dr. Shi has published more than 30 technical papers in areas of optoelectronics, microwave circuits, and digital circuit packages. Dr. Shi obtained his B.S. in electrical engineering from Xi'an Jiaotong University, his M.S. in physics from DePaul University, and his Ph.D. in the microwave optoelectronics field from CREOL College of Optics at the University of Central Florida.