TP-TA3.2

BGA Ground Ball Placement

Tuesday, February 7 | 10:35 am – 10:55 am

Ever wonder why big chips have so many power and ground pins? This paper will explain why. The main topic to be discussed is crosstalk—specifically, the crosstalk that occurs underneath a BGA package in the spaces between the balls and the PC board. The presentation will also present a large-scale model of a BGA package. It will modify, in real time, the pattern of power and ground pins within the package while observing crosstalk. It will also compare alternate power and ground pin patterns and discuss the use of virtual ground, or soft-ground, connections to mitigate crosstalk.

Dr. Howard Johnson, Singla Consulting, Inc.