Jun Fan, NCR
Zhiping Yang, Principal Integrity Engineer, Apple Computer
Istvan Novak, Senior Staff Engineer, Sun Microsystems
Todd H. Hubing, Professor, University of Missouri-Rolla
James L. Drewniak, Professor, University of Missouri-Rolla
Joel S. Peiffer, Lead Engineering Specialist, 3M

Do you want to be prepared before the wide adoption by the industry of the embedded capacitance (on-die and thin-laminate) and embedded capacitors? Do you know how to model and evaluate their performance at the system level? Are you wondering when and where you can use these new technologies in your own designs? What are the benefits and tradeoffs you will get as a designer? This TecForum will be focused on the electrical modeling and analysis of the embedded capacitance and embedded capacitors; overview of the recent progress on material, manufacturability, and reliability; and ideas and experiences from OEMs on the applications of these technologies. After the presentation, the audience should be equipped with general knowledge about the embedded capacitance and embedded capacitors.