Collaboration and tighter process integration are required in order to bridge this gap and accelerate the rate at which customers can move beyond 65 nm. This panel will focus on prevalent industry challenges in design and manufacturing, such as making designs more robust for manufacturing, improving manufacturing yield, and the real complexities of integration.
Dylan McGrath
EDA/Design Editor
EETimes
Mr. McGrath has been the EDA/design editor for EE Times.com since March 2005. He has nearly 10 years of experience in semiconductor industry journalism and public relations/marketing.
Dinesh Bettadapur
President and Chief Executive Officer
ASML MaskTools
Mr. Bettadapur is president and chief executive officer of ASML MaskTools, a position he has held since April 2001. In this role, Mr. Bettadapur is responsible for establishing ASML MaskTools as a leader in advanced optical lithography extension solutions that are applicable to chip manufacturing at 65 nm and beyond. He is also responsible for the overall company strategy, sales, marketing, and business development. Mr. Bettadapur joined ASML from Monterey Design Systems, where he served as executive vice president responsible for business operations. Prior to that, he worked for nearly eight years at Intel Corporation in a variety of technical and management roles. Mr. Bettadapur holds a master's degree in electrical engineering from Virginia Tech and a bachelor's degree in electrical engineering from Bangalore University.
Franklin Kalk
Chief Technology Officer
Toppan Photomasks, Inc.
Dr. Kalk is Toppan Photomasks' chief technology officer, the same position he held at DuPont Photomasks beginning in April 2004. He leads Toppan Photomasks' global research and development programs, supporting customers' technology roadmaps. Dr. Kalk joined DuPont Photomasks in 1992, and he has led several tool and material development programs and served as manager of the research and development group at the DPI Reticle Technology Center (RTC). For the past several years, Dr. Kalk focused on photomask resolution-enhancement technology issues and led company-wide programs aimed at improving the quality and yield of photomask products. Prior to joining DuPont Photomasks, Dr. Kalk held a number of engineering and research positions within the electronics group of E.I. duPont de Nemours & Co. Dr. Kalk began his career in optical data storage research and development at Storage Technology Corp.
Mark Miller
Vice President, Business Development
Design for Manufacturing
Cadence Design Systems
Prior to joining Cadence, Mr. Miller held similar positions with Tera Systems, a leading provider of silicon virtual prototyping EDA software, and Synchronicity, a leader in design reuse, collaboration, and management solutions for electronic product development. He enjoys nearly 25 years of sales, marketing, development, and design experience in the electronics and EDA industries.
Mike Smayling
Chief Technology Officer
Maydan Technology Center Group
Applied Materials
Dr. Smayling is a chief technology officer for the Maydan Technology Center group at Applied Materials. Prior to joining Applied in 1999, he was at Texas Instruments for 18 years, where he was a TI Fellow responsible for process and technology design in DRAM, FLASH, mixed signal, and CMOS logic. Dr. Smayling has a Ph.D. in electrical engineering from Rice University in Houston, and has been a lecturer/adjunct professor at Rice for the past 14 years. He has received 85 U.S. patents covering semiconductor processing and design and has published more than 40 technical papers on semiconductor devices, photolithography, and lasers. Dr. Smayling represents Applied at the SRC/MARCO Focus Centers for circuit and device research.
Vincent Tong
Vice President of Product Technology, Advanced Products Group
Xilinx, Inc.
Mr. Tong is the vice president of product technology for the FPGA Products group at Xilinx in the United States. He is responsible for engineering activities involving products, testing, performance, yield enhancement, and customer support, as well as new product introductions, test coverage, and cost reduction. He also oversees advanced technology partnerships with wafer foundries, subcontractors, and other vendors. Mr. Tong joined Xilinx in 1990 as manager of product and test engineering. Most recently, he worked as senior director of the Product Technology group. Prior to joining Xilinx he worked in a variety of design and product and test engineering roles at Monolithic Memories, Inc. and Advanced Micro Devices Corp. Mr. Tong has a bachelor's degree in electrical engineering and computer science from the University of California, Berkeley.
Hamid Torabi
Chief Technology Officer, S/C Technology Platform
IBM
Mr. Torabi leads the Technology Platform's technical and manufacturing strategy and enablement. Before holding his current position, Mr. Torabi was part of IBM's Engineering and Technology Services Group, supporting clients in semiconductor process, manufacturing, and factory automation. In earlier IBM assignments, he was responsible for the technical operations of IBM's joint venture semiconductor fabricators worldwide. Mr. Torabi has led groups in design, process developments, manufacturing, and reliability engineering.