John Andresakis, Vice President of Strategic Technology, Oak-Mitsui Technologies
Pranabes Pramanik, Oak-Mitsui Technologies
Daniel Brandler, Ohmega Technologies, Inc.
Dong Nong, Ohmega Technologies, Inc.

Many articles have been published on the benefit of thin substrates for use as embedded capacitor layers as well as thin layers of resistive material for embedded resistors. Until now, the utilization of both technologies within a printed circuit design required the use of separate cores within the PCB. This adds additional thickness to the PCB as well as cost. This presentation will concentrate on new substrates with the combined functionality that will address these issues.