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Previous DesignCons: 2005
2005 Archive
Highlights | Schedule | Exhibitor List

TF7
Inductance of Bypass Capacitors: How to Define, How to Measure, How to Simulate?
Monday January 31 | 1:30pm - 4:30pm

Istvan Novak, Senior Staff Engineer, Sun Microsystems
Zhiping Yang, Senior Signal-Integrity Engineer, Cisco Systems
Leigh Wojewoda, Senior Packaging Engineer, Intel
Larry Smith, Signal-Integrity Engineer, Sun Microsystems
Hideki Ishida, Sanyo Electric Co., Ltd.
Masayuki Shimizu, Taiyo Yuden Co., Ltd.

Have you ever wondered why the same size bypass capacitor is listed with different inductance from different vendors? Do you want to know how some of the major OEMs want the inductance to be determined? Are you interested in knowing how major capacitor vendors measure the inductance? This TecForum will give an overview of how OEMs (Cisco, Intel, SUN, Xilinx) model capacitors, what are the important contributors to a capacitor's inductance in a real design, as well as how capacitor vendors (Sanyo, TDK, and others) do the testing. Participants who want a dialog with the presenters, are encouraged to attend the panel discussion "Bypass capacitors: how to determine their inductance?"