PCB laminates have become the object of increasing Electronics Industry focus. The Data and Telecom Industries have recently pumped-up the value statement defining PCB laminate selection criteria extending:
- Advanced Performance Requirements including high-speed channel demands, mechanical stability and extended thermal performance,
- Environmental Controls including lead-free compatibility, CAF resistance and RoHS considerations,
- Cost Sensitivity targeting increased applied value and functionality.
Panel Chair
David Brunker
Technical Fellow, Molex
David Brunker has developed products in the areas of shielded and high-speed connectors, high-speed cable and PCB transmission links and fiber optics. Mr. Brunker has been a contributing member in various Standards organizations and MSA's including IEEE 1394a and 1394b, DVI, VESA EVC and P&D and Serial Storage Architecture. He holds 41 U.S. and numerous International patents. Dave received his BS in Psychology with emphasis in Psychoacoustics from the University of Illinois at Urbana-Champaign.
Speakers
Tarun Amla
Vice President, Technology and New Product Development, Isola Group
Tarun Amla is responsible for global Research and Technology and global OEM marketing. His primary focus is managing New Product Development, Introduction and Marketing. During his 17 years in the electronics industry, Mr. Amla has gained extensive experience in General management, Manufacturing Operations, Engineering, Product Technology, Marketing and Sales. His areas of specific technical expertise include Heat and mass transfer, Process design, Material and polymer science, Operations Research, Process simulation and Modeling.
Thomas McCarthy
Director of Engineering, Advanced Dielectric Division, Taconic
Thomas McCarthy has a BA in Chemistry from Wesleyan University, a PHD in polymer science and engineering from U MASS, Amherst, and an MBA from Rensselaer Polytechnic. Mr. McCathy has worked at the Max Planck Institut for Polymer Research, the AlliedSignal Corporation, and now Taconic. He has approximately 20 patents and publications in the areas of fluoropolymers and electronic materials and is currently the Product Manager for Taconic's TacPregTM product line and the Director of Engineering.
Bob McGrath
HPC Design and Applications Engineer, Teradyne
Mr. McGrath has more than 26 years experience in printed circuit board manufacturing, with expertise in both backplane and daughtercard technologies. Bob works closely with customers early in the design phase, integrating with PCB technology and fabrication teams to deliver High-Performance Circuit designs that meet both performance and manufacturability requirements. Bob has a B.S. in Industrial Technology from Northeastern University.
Brian Nelson
Product Manager, Sanmina
After earning a Bachelor's Degree in Mechanical Engineering from San Jose State University, Brian Nelson worked briefly in environment engineering controls beforemigrating to PWB manufacturing in 1981. There he worked in fabrication heading several front-end tooling departments including a 10-year stint as such at Sanmina. Now in his 18th year with the company, Mr. Nelson is responsible for PWB NPI engineering which is essentially a client consultant DFM phase prior to layout design.
David Wiens
Director, Business Development, Systems Design, Mentor Graphics
David Wiens is a business development director for the Systems Design Division of Mentor Graphics. David joined Mentor Graphics in 1999 through the acquisition of VeriBest. Over the past 20 years he has held various engineering, marketing and management positions within the EDA industry. Focus areas have included advanced packaging, high-speed design, routing technology and integrated systems design. David holds a B.S. degree in computer science from the University of Kansas.