Marc Cartier, Signal-Integrity Engineer, Connection Systems Division, Teradyne
Tom Cohen, Principal Development Engineer, New Product Development, Teradyne
Brian Kirk, Signal-Integrity Engineer, Connection Systems Division, Teradyne

This paper will show examples of both traditional and advanced solutions to orthogonal midplane architectures with a description of mechanical, thermal, and electrical benefits/limitations. Most examples involve the use of backplane connectors that have been optimized around routing channels and densities for traditional backplane/card cage systems. Finally, the paper will describe a novel approach which involves a new interconnect system that is optimized for orthogonal implementation. By using new connector technologies, the resonance phenomenon of the plated through hole is mitigated. Consequently, these developments remove the need for backdrilling operations or complex circuit board technologies. The resulting system is an improved performance, reduced cost, orthogonal architecture.