Attendees will have a firsthand look at many new technologies at DesignCon 2004, including, but not limited to, the following:
| Company: | | Product: |
| @HDL, Incorporated | | @Designer-PROTM |
| 0-In Design Automation | | Part of Archer-CDV Product |
| Aeroflex | | ARM7 Sensor Micros with Human Interface |
| Agilent Technologies | | Agilent 86100C Infiniium digital communications analyzer with jitter analysis |
| Ansoft Corporation | | Ansoft's SI product suite |
| Apache Design Solutions, Inc. | | NSPICE |
| Applied Simulation Technology | | ApsimPI-IC |
| Atrenta Inc. | | Atrenta's® SpyGlass® Constraints Analyzer |
| Avnet | |
PCI-X Design Kit
Embedded FPGA Linux Design Kit
High-speed IP Design Kit |
| Axis Systems | | XoCTM, Xtreme®, and Xcite® |
| CAST, Inc. | | CAST IP Cores-JPEG, USB OTG, FireWire |
| Cimmetry Systems | | AutoVue |
| Circuit Semantics | | DynaCellTM, DynaCoreTM, DynaModelTM |
| CST of America | | CST Microwave Studio® |
| Design And Reuse | | D&R IP/SoC Marketplace |
| DOLPHIN Integration | | SoC Integration Platform for 8051/251 |
| EIA/IBIS Open Forum | | IBIS 4.0 and IBIS ICM 1.0 Specifications |
| Europractice IC Service | | 0.13um ASIC prototyping |
| Faraday Technology Corporation | | MPCA - Metal Programmable Cell Array |
| FCI | | AirMax VSTM |
| First Silicon Solutions (FS2) | | FS2 MEDTM Multicore Embedded Debug System |
| HARTING Electro-Optics | | HARTING® parecon 30 XFP |
| Interconnect Systems, Inc. | | HiLo Flexible Interconnect System |
| INICORE | | DiaLiteTM Instrumentation |
| iRoC Technologies | | iRoC Soft Error Design Services |
| ITT Industries, Cannon | | Connector
APD Circular Connector
Navigation Switch
|
| JAE Electronics, Inc. | | DG1 Series |
| Kluwer Academic Publishers | | Scientific Research Books |
| Legend Design Technology, Inc. | | CharFlo-Memory! MSIM, Turbo-MSIM |
| Meritec/Joy Signal Technology | | Infiniband 4X & 12X Cabling Solutions |
| Micron Technology, Inc. | | DRAM, Flash Memory, MCP, PSRAM, CMOS Image Sensors |
| Molex Incorporated | | Plateau HS DockTM Connectors |
| MoSys, Inc. | | MoSys 1T-SRAM memory technology |
| Novas Software | | Reusner Design Knowledge Publisher |
| OEA International, Inc. | | SPIRALTM |
| Optical Internetworking Forum (OIF) | | OIF Common Electrical Interface Project |
| Optimal Corp. | | PakSi-Wave and SIDEA |
| Picosecond Pulse Labs | | Model 4022 9 ps Differential TDR/T Source |
| Sagantec | | AnacondaTM |
| Sandwork Design, Inc. | | SPICE Explorer |
| Signal Integrity Software, Inc. | | SiAuditor |
| Sigrity, Inc. | | Speed XP |
| Silicon Integration Initiative (Si2) | | OpenAccess |
| Sonnet Software, Inc. | | Sonnet Professional 9 |
| Summit Design, Inc. | | System Architect
Visual Elite
Visual Elite ESC |
| Synopsys | |
Synopsys Professional Services
Synopsys Functional Verification for 2004's Challenging Designs
Synopsys DiscoveryTM Verification Platform
|
| Synplicity, Inc. | | Amplify® RapidChipTM Physical OptimizerTM |
| TDA Systems, Inc. | | IConnect TDR and VNA Software |
| Teradyne Connection Systems | | HD-OptyxTM - Industry's First Modular Optical InterconnectVHDM® H-Series - High-Speed, High-Density Connector |
| Thin Film Technology | | Delay lines, equalizers, and precision resistors |
| TriCN, Inc. | | Interface Specific I/O (ISI/O) product family |
| Veritools |
|
Undertow Suite |
| Viasystems | | Closed Loop Backdrilling/LCDViawave Optical Backplane |
| Virtual Silicon | | Virtual Silicon VIPTMStandard Cells |
| Wavecrest | | GigaViewTM SA |
| W.L. Gore & Associates, Inc. | | GoreTM Eye-Opener® ZD Cable Assembly |
| X2Y Attenuators, LLC | | X2Y Technology |
| Zeland Software | | SpiralSyn for IE3DLibraryIE3D Electromagnetic Simulation and Optimization Package 10.1 |
